Lucent Technologies Inc.

Other

Lucent Technology

Shiaw-Jong Steve Chen

Roger J Hooey

Robert E Radke

Feng Lin

Ashraf W Lotfi

John David Weld

Robert Joseph Roessler

Wayne C Bowman

Thang Danh Truong

The present invention provides an integrated cooling device employing heat pipes for cooling an electronic component and a method of manufacturing the same. In one embodiment, the integrated cooling device includes a plate couplable to and supportable by the electronic component. The plate has at least one channel therein that presents an enhanced surface area. The cooling device further includes a sealed heat pipe having a heat-receiving portion fitted within the channel such that the enhanced surface area in contact with the heat pipe experiences an increased thermal communication between the plate and the heat pipe. The heat pipe also has a heat-removing portion that is distal from the heat receiving portion. Inside the heat pipe, a fluid, initially located in the heat-receiving portion of the heat pipe as a liquid, receives heat and evaporates to form a vapor that travels to the heat-removing portion. In the heat-removing portion of the heat pipe, the vapor condenses and cycles back o the heat-receiving portion.

Top mounted cooling device using heat pipes

The present invention provides a miniature liquid transfer pump. The pump has a housing that includes first and second blocks joinable to form a leak-resistant impeller chamber with a drive shaft aperture, an inlet and an outlet. An impeller is located in the impeller chamber and a micro-motor with a drive shaft extending therefrom is mounted to the housing. The drive shaft on the micro-motor passes through the drive shaft aperture and engages the impeller. The micro-motor drives the impeller to draw liquid through the inlet and eject the liquid through the outlet.

Miniature liquid transfer pump and method of manufacturing same

A header containing a semiconductor die, method of manufacture thereof and electronic device employing the same. In one embodiment, the header includes first and second contacts, and an intermediate body. The intermediate body includes an insulated section interposed between the first and second contacts and has a cavity therein. The intermediate body also includes a semiconductor die, located within the cavity, adapted to condition a signal passing through at least a portion of the header.

Header, a method of manufacture thereof and an electronic device employing the same

An electronics case, a method of manufacturing the same and a power module incorporating the case. In one embodiment, the case includes: (1) an enclosure including a metal substrate that forms walls of the enclosure and a dielectric material located on inner surfaces of the walls that insulate the substrate from electronics components located within the enclosure and (2) an electrically conductive pin, affixed to a sidewall of the enclosure substrate and extending to without the enclosure, that allows the substrate to be electrically coupled to a structure supporting the case for EMI (electromagnetic interference) shielding or case-grounding purposes.

Fixed conductive pin for printed wiring substrate electronics case and method of manufacture therefor

The present invention provides an encapsulant structure for retaining an electronic circuit having heat-generating components within a case that at least partially surrounds the electronic circuit. In one advantageous embodiment, the encapsulant structure provides for a thermally conductive insert to be located within the case proximate the heat-generating components. The insert increases the heat transfer efficiency from the electronic circuit to the case.

Encapsulated power supply with a high thermal conductivity molded insert

An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement. The apparatus comprises a metal substrate having a first side and a second side, a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum alternated with at least one first-side dielectric stratum affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum alternated with at least one second-side dielectric stratum affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.

Circuit board apparatus

An integrated cooling device for use in cooling an electronic component or an integrated circuit and a method of manufacturing the same. In one embodiment, the device includes: (1) a plate couplable to and supportable by the electronic component, the plate having at least one channel therein, (2) a closed-circuit circulation pipe having a heat-receiving portion disposed in the at least one channel to place the heat-receiving portion in thermal communication with the plate, the circulation pipe further having a heat-removing portion distal from the heat receiving portion, (3) a coolant located within the circulation pipe and (4) a pump coupled to the circulation pipe, supported by the plate and operable to cause the coolant to circulate through the circulation pipe.

Integrated active cooling device for board mounted electric components

For use with a plate having a via located therethrough an electrical connector configured to transfer an electrical signal from one major surface of a plate to the other major surface, a method of manufacturing the electrical connector and a board mounted power supply utilizing the same. In one embodiment, the electrical connector comprises a dielectric layer coating a peripheral wall of the via and extending therefrom to coat portions of the opposing major surfaces of the plate adjacent the via. The electrical connector further comprises a conductive contact layer that covers a portion of the dielectric layer and extends to portions of the opposing major surfaces to form opposing contacts thereon.

Through via plate electrical connector and method of manufacture thereof

For use in a power supply having a bias circuit with a bias transformer, an auxiliary bias circuit and a method of providing power via the auxiliary bias circuit to an auxiliary load. In one embodiment, the auxiliary bias circuit includes a blocking device coupled to the bias transformer. The auxiliary bias circuit also includes a storage device, coupled to the blocking device and across the bias transformer, that provides a voltage to drive the auxiliary load without requiring a separate power supply.

Auxiliary bias circuit for a power supply and a method of operation thereof

An insulated metal substrate printed wiring board includes a thermally conductive base plate. A first dielectric layer is disposed on the base plate. An electrically conductive trace is disposed on the top surface of the first dielectric layer. A second dielectric layer is disposed on the top surface of the first electrically conductive trace. A second electrically conductive trace is disposed on the top surface of the second dielectric layer. The second dielectric layer and the second electrically conductive trace include an aperture to expose the electrically conductive trace disposed on the top surface of the first dielectric layer. High power dissipating components are mounted through the aperture in the second electrically conductive layer and second dielectric layer for electrical connection to the electrically conductive trace disposed on the top surface of the first dielectric layer. Similar construction can be extended to more than two layers of electrically conductive traces and the aperture is through all the layers except the first dielectric layer and the first electrically conductive layer.

Multi-layer insulated metal substrate printed wiring board having

An electronics case, a method of manufacturing the same and a power module incorporating the case. In one embodiment, the case includes: (1) an enclosure including a metal substrate and a dielectric material located on inner surfaces of the enclosure that insulate the substrate from electronics components located within the enclosure, the enclosure having an aperture on a major surface thereof and (2) an electrically conductive pin, passing through the aperture and an interior of the enclosure to emerge from the enclosure at a point opposite the major surface, the pin functioning both as a heat sink mount for the case and a case ground pin for the substrate.

Self-locking conductive pin for printed wiring substrate electronics case

A method of mounting a power semiconductor die on a substrate, a package for the die and a power supply including the package. The die has a first power terminal on a first surface thereof and a second power terminal on an opposing second surface thereof. The method including the steps of: (1) forming an electrically-conductive, mechanical bond between the first surface and a first location on the substrate, the mechanical bond electrically coupling the first power terminal to the substrate and (2) soldering an elongated electrically conductive strap to the second surface and a second location on the substrate, the conductive strap composed of a material having an electrical resistivity at most about 5.0.times.10.sup.-8 ohm-meters (.OMEGA.-m) and forming a low impedance path between the second power terminal and the second location.

Method of mounting a power semiconductor die on a substrate

A power supply and a method of manufacturing the same. In one embodiment, the power supply includes: (1) a substrate, (2) a main power supply mounted on the substrate and having an input and a main output, (3) an auxiliary power supply mounted on the substrate, coupled to the input and having an auxiliary output and (4) a cooling device mount, coupled to the power supply, configured to receive and support a cooling device, the auxiliary output configured to provide electric power to the cooling device.

Board mounted power supply having an auxiliary output

The present invention relates to semiconductor devices packaged using overcasting. The overcast devices of the present invention incorporate encapsulative materials, such as ultraviolet-curing material, which are cast in open stencils at approximately ambient pressure (and potentially at approximately ambient temperature) over electronic components mechanically and electrically connected to the substrate. The overcast semiconductor devices of the present invention may incorporate new encapsulative materials, including UV-cured materials and longer shelf life materials, poorly suited for the pressures and temperatures of injection molding. The overcast devices also allow the incorporation of substrate materials which are not feasible for use with a higher pressure, higher temperature forming process. At the same time, the overcast devices of the present invention maintain the low profiles associated with overmolding rather than the larger/taller profile packages generated by shell and gel and preformed package methods.

Overcast semiconductor package

A package for a power magnetic device containing an isolation transformer having a primary and secondary winding, and a method of manufacture therefor. The package includes: an encapsulant substantially surrounding the isolation transformer, first and second cavities formed in the encapsulant proximate the primary winding and the secondary winding, the first cavity exposing a first tap of the primary winding and adapted to receive a switch therein, the first tap of the primary winding adapted to couple the switch to the primary winding, the second cavity exposing a first tap of the secondary winding and adapted to receive a first rectifying device therein, the first tap of the secondary winding adapted to couple the first rectifying device to the secondary winding, the first and second cavities adapted to be encapsulated after receiving the switch and the first rectifying device therein to allow the switch, the first rectifying device and the primary and secondary windings of the isolation transformer to be joined into a unitarily encapsulated package.

Growing community of inventors

Plano, TX, United States of America

Shiaw-Jong Steve Chen