Sae Magnetics (h.k.) Limited

Shi Xiong Chen

Ryuji Fujii

Wen Rong Guo

Zeng Hui Zhang

Bin Qi

Takashi Honda

Seiichi Takayama

Jian Hui Huang

Natsuo Nishijima

Osamu Harakawa

Kiyohiko Abe

Peng Liu

Long Ping Wang

Lin Huang

Yong Lei

Yong Jun Zhang

The present disclosure discloses a magnetic head, a head gimbal assembly, a hard disk drive, and a method for processing a magnetic head. The method comprises irradiating at a fixed point proximal to the read/write part with a laser irradiation device until the read head and the write head are thermally expanded; orientating air bearing surfaces of a plurality of magnetic heads forming a magnetic strip toward a lapping surface of a lapping device after laser irradiation, holding the air bearing surfaces in place, lapping with the lapping device until the air bearing surfaces are coplanar; and disassembling the magnetic strip to obtain a lapped magnetic head. Through laser heating induced compensation, the heights of lapped read head and write head of the magnetic head meet their respective target values, ensuring the normal reading and writing of the storage medium of the magnetic disk.

Magnetic head, head gimbal assembly, hard disk drive, and method for processing magnetic head

A lapping method of a MAMR head slider includes a first lapping process: controlling the lapping plate to spin at a first speed, and controlling the MAMR head slider to move at a first moving speed, and applying a first force to the MAMR head slider; and a second lapping process: controlling the lapping plate to spin at a second speed that is lower than the first speed, and controlling the MAMR head slider to move at a second moving speed that is lower than the first moving speed, and applying a second force that is lower than the first force to the MAMR head slider; and the second lapping process includes a final lapping process section, and the second force in the final lapping process being zero. In such a way, lapping marks on the ABS are reduced to improve the roughness and the reliability.

Microwave assisted magnetic recording head slider and lapping method thereof

A thermally assisted magnetic recording head and a thermally assisted magnetic recording disk drive are disclosed. The thermally assisted magnetic recording head includes a slider body, a laser substrate, a laser and a magnetic head, wherein the laser substrate is provided on the slider body, the laser is provided on the laser substrate, and the magnetic head is provided at a front end of the slider body. The magnetic head includes an optical waveguide facing the laser. The angle between a light incident surface of the optical waveguide and an incident direction of a laser light incident on the optical waveguide is less than 90 degrees. The thermally assisted magnetic recording disk drive includes a plurality of magnetic disks and a magnetic head suspending frame. A front end of the magnetic head suspending frame is provided with the thermally assisted magnetic recording heads mentioned above.

Disk drive thermally assisted magnetic recording head having a slider and a tilted light incident surface

A row bar for forming magnetic heads includes a row of magnetic head forming portions each having a magnetic head and a cutting portion adjacent to the magnetic heads. A row of bonding pads and a first ELG pad are provided at the magnetic head, a second ELG pad is provided at the cutting portion, both of the first and the second ELG pads are adapted for contacting with a probe during lapping process, and a conductive structure that is higher than surfaces of the first and the second ELG pads is formed at peripheries of the first and the second ELG pads respectively. Due to the conductive structures, a probe used in lapping process will be prevented from shifting from the ELG pads to ensure a stable contact, thereby obtaining efficient and accurate resistance measurement.

Row bar and wafer for forming magnetic heads

A coupling structure of optical components has a first optical component, a second optical component and a coupling solder layer. The first optical component has a lensed fiber, a first holder holding the lensed fiber and a first metal layer formed on a first connecting end face of the first holder. The second optical component has a waveguide, a second holder holding the waveguide and a second metal layer formed on a second connecting end face of the second holder. The coupling solder layer is in direct contact with both of the first metal layer and the second metal layer, and formed with solder.

Coupling structure of optical components and coupling method of the same

Growing community of inventors

Hong Kong, China

Shi Xiong Chen