Intel Corporation

Shanghai Wonsung Alloy Material Co., Ltd.

Shi Liu

Huaning Niu

Yang-Seok Choi

RongZhen Yang

Yi Liu

Baichuan Liu

The present application relates to the technical field of electroplating, and particularly to a bonding copper wire plated with palladium and gold and an electroplating process thereof. The electroplating process includes: electroplating a first palladium layer on a surface of a copper wire with a first palladium plating solution, electroplating a second gold layer with a first gold plating solution to obtain a semi-finished product, electroplating a third palladium layer onto the semi-finished product with a second palladium plating solution, and electroplating a fourth gold layer with a second gold plating solution to obtain a finished product; and the first palladium plating solution comprises tetraamminepalladium acetate, 4-sulfamoylbenzoic acid and 6-azauracil.

Bonding copper wire plated with palladium and gold and electroplating process thereof

Channel quality indexing and reverse indexing is described. In one example, a quality value for subbands of a radio communications system are measured. An index for each quality measurement is then determined and a combinatorial index is generated to reflect the indices and the selected subbands. The combinatorial index is then sent to a radio station using a radio communications channel.

Channel quality indexing and reverse indexing

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Shanghai, China

Shi Liu