Sercomm Corporation

Shi-Jun Weng

Cheng-Chung Chang

A heat dissipation housing includes an outer casing and the heat conduction block. The heat dissipation housing includes a thickness portion and at least one first tenon extending towards the inner direction of the outer casing from the inner surface of the thickness portion. Heat conduction block includes a base and at least one second tenon extending towards the outer direction of the outer casing from the base. The first tenon and the second tenon are combined, such that the first tenon, the second tenon, and the base together form a column extending towards the inner direction of the outer casing from the inner surface of the thickness portion. The outer casing and the heat conduction block both have a thermal conductivity greater than 0.5 W/m-k.

Heat dissipation housing, manufacturing method thereof and electronic device using the same

The present invention relates to a removable hard-disk structure without screws at least comprising a housing, a first elastic arm, a second elastic arm and a removable component. The housing having a placing space is connected to an opening end to enable the hard disk be placed into the placing space, and a door plate is further installed at the opening end to avoid the hard disk departing from the housing. The first and the second elastic arms are installed at the top surface and two side surfaces respectively, and these elastic arms are cantilever type and extend a pressing end into the placing space, which holds and presses the hard disk, and the hard disk is correctly being placed into the placing space. The removable component has a connecting end which is connected into the placing space, as the hard disk is placed in the placing space, the removable component fits the hard disk, and thus the hard disk can be easily removed by applying force on the removable end of the removable component.

Growing community of inventors

Suzhou, China

Shi-Jun Weng