Samsung Electronics Co., Ltd.

Dongwoo Fine-chem Co., Ltd.

Samsung Display Co., Ltd.

Dongwoo Fine-chem

Shi-Jin Sung

Sang-tae Kim

Seung-Hyun Ahn

Ahn-Ho Lee

Sang-Tae Kim

Hi-Kuk Lee

Yong-Il Kim

Cha-Dong Kim

Jung-In Park

Yong-il Kim

Su-Yeon Sim

Sang Hyun Yun

Kyong-ho Lee

Baik-Soon Choi

Kyong-Ho Lee

Sang-Haeng Lee

Jin-Seok Yang

Eun-Sang Lee

Sung-Yeol Jin

A thinner composition including an acetate-based compound in an amount in a range of about 30 weight percent to about 70 weight percent, a lactate-based compound in an amount in a range of about 1 weight percent to about 20 weight percent, a propionate-based compound in an amount in a range of about 30 weight percent to about 60 weight percent, and an ether-based additive in an amount in a range of about 10 ppm to about 500 ppm, based on a total amount of the composition.

Thinner compositions

A photoresist composition, a method of forming a pattern using the photoresist composition, and a method of manufacturing a display substrate are disclosed. A photoresist composition includes an alkali-soluble resin, a quinone diazide-based compound, a multivalent phenol-based compound, and a solvent. Therefore, photosensitivity for light having a wavelength in a range of about 392 nm to about 417 nm may be improved, and reliability of forming a photo pattern and a thin film pattern using the photoresist composition may be improved.

Photoresist composition, method of forming a pattern using the same, and method of manufacturing a display substrate

In a thinner composition and a method of forming a photosensitive film, the thinner composition includes about 50 to about 90% by weight of propylene glycol monomethyl ether acetate, about 1 to about 20% by weight of propylene glycol monomethyl ether, about 1 to about 10% by weight of &#x3b3;-butyrolactone, and about 1 to about 20% by weight of n-butyl acetate. The thinner composition may have a proper volatility and an improved ability to dissolve various types of photosensitive materials, and thus the thinner composition may be usefully employed in an edge bead rinse process, a rework process or a pre-wetting process.

Methods of forming a photosensitive film

Disclosed is a resist composition which has desirable physical properties such as sensitivity, resolution, residual film ratio and coating property, and forms a pattern having the desirable profile and depth of focus due to excellent light transmissivity during a semiconductor process and a flat panel display process using a short wavelength of 248 nm (KrF) or less, even though the resist composition is applied to a non-chemically amplified resist. The photoresist composition comprises a novolac-based resin A, a photosensitizer B, and a low molecular substance C having low absorbance. The low molecular substance having low absorbance has absorbance that is lower than absorbance of the novolac-based resin at one or more wavelengths of 248 nm, 193 nm, and 157 nm, and the photoresist composition is used at the wavelength of 248 nm or less.

Photoresist composition and patterning method thereof

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Seoul, South Korea

Shi-Jin Sung