Other

Power Wave Electronic Co., Ltd.

Onewave Technology Co., Ltd.

Shi-Hong Yang

Yun-Chan Tsai

Wen-Jiao Liao

Po-Huai Huang

Shi-Yu Chiu

Shih-Hsun Hung

A method of manufacturing chip antenna and a structure of the chip antenna. The method includes the following steps: preparing a substrate, drilling a plurality of rows of external through holes and internal through holes arranged longitudinally, forming fishing grooves at the predetermined distance between every two of the internal through holes arranged longitudinally, electroplating a metal material on the external through holes and the internal through holes, to form a conductive layer. Afterward, a circuit layer is formed on the conductive layer by exposure, development, and etching techniques. An ink is printed on the substrate after the circuit layer finished, and the ink cover parts of the circuit layer and parts of the substrate exposed, to form a solder mask and a recognition pattern layer. Finally, a longitudinal cutting line and a horizontal cutting line are cut on the substrate, and to form a chip antenna.

Method of manufacturing chip antenna and a structure of the chip antenna

An antenna-structure combination method includes following steps. Provide a circuit board. At least one joint hole penetrating the circuit board is formed in the circuit board. At least one electrode layer and one feeding line are formed on a periphery of the joint hole. The feeding line is electrically connected to the electrode layer. Provide a chip antenna. The chip antenna includes a base. The base has a wiring section. A fixed connection section is arranged at one end of the wiring section. The fixed connection section is formed with a conductive layer. The fixed connection section of the chip antenna penetrates the joint hole of the circuit board, so that the conductive layer is electrically fixed to the electrode layer, so that the chip antenna is fixedly connected onto the circuit board in an upright manner.

Antenna structure and antenna-structure combination method

A chip-type antenna structure includes a baseboard, a matching element, a radiation single body and a frequency-modulation element. The baseboard includes a first-ground surface, a first-clearance area and a signal-feed-in unit. A second-ground surface, a second-clearance area, a third-ground surface and a plurality of via holes through the baseboard and electrically connected to the first-ground surface and the second-ground surface are arranged on the other side of the baseboard. The matching element is electrically connected between the signal-feed-in unit and the first-ground surface. One side of the radiation single body is electrically connected to the signal-feed-in unit through the via holes. The other side of the radiation single body is electrically connected to the third-ground surface. The frequency-modulation element is electrically connected between the second-ground surface and the third-ground surface to adjust the frequency-modulation element to adjust a receiving-transmitting frequency of the chip-type antenna structure.

Chip-type antenna improved structure

A shoe pad assembly has a first layer, a second layer, a third layer, and an elastic base layer. The first layer is an air permeable fabric. The second layer has a gauze dipping in a solution containing activated carbon, alum, resin and ceramic powders producing far-infrared to form two web-shaped films on the gauze to become an air permeable layer. The third layer is a water absorbing polyethylene terephthalate non-woven fabric layer.

Shoe pad assembly

A cushion pad has an upper layer, a middle layer, and a lower layer. The middle layer is disposed between the lower layer and the upper layer. The upper layer is made of an air-permeability fabric. The middle layer has two mixture layers, and a gauze fabric layer disposed between the mixture layers. The lower layer is made of a water-absorbing non-woven fabric.

Growing community of inventors

Taipei, Taiwan

Shi-Hong Yang