Osram Gmbh

Osram Opto Semiconductors (malaysia) Sdn. Bhd

Shi Chai Chong

Ewald Guenther

Hooi Bin Lim

Hagen Klausmann

Cheng Kooi Tan

David Lacey

An electroluminescent device having a protection layer in the cap bonding region to which the cap is bonded. The protection layer can be formed from photosensitive or non-photosensitive materials. The protection layer protects the layers below from being damage during removal of polymer materials.

Encapsulation for electroluminescent devices

A method to ensure uniform deposition of organic layer is disclosed. Since the organic layer is very thin, any deviation from the target thickness will result in visible optical defects. A homogenous layer which exhibits good coating behaviour with organic materials is provided beneath the organic layer. By covering the metal interconnects, the adverse effect on the uniformity of the polymer layer is reduced or prevented.

Uniform deposition of organic layer

Growing community of inventors

Penang, Malaysia

Shi Chai Chong