Cabot Corporation

Ngk Metals Corporation

Sherwood Goldstein

Paul J Scherbner

Sam Friedman

Henry T McClelland

Yoshio Ito

Paul J Scherbner, Deceased

A treatment process is provided for a copper-beryllium alloy comprising from about 0.2% to about 0.7% beryllium, no greater than 3.5% of cobalt and/or nickel, no greater than 0.5% of titanium and/or zirconium and at least 90% copper, wherein the alloy has been cold worked to a ready-to-finish gauge, comprising the steps of annealing the cold worked ready-to-finish gauge copper-beryllium alloy at a temperature from about 1500.degree. F. to about 1685.degree. F., cold working the annealed copper-beryllium alloy to reduce its gauge to a range of from about 20% to about 60%, and age hardening the copper-beryllium alloy at a temperature of from about 700.degree. F. to about 950.degree. F. for about 1 to about 7 hours. The alloy is characterized by satisfactory levels of strength and electrical conductivity as well as enhanced levels of formability, particularly in the direction parallel to the direction of rolling the alloy.

Process for treating a copper-beryllium alloy

Disclosed is a moderate electrical conductivity copper alloy containing titanium and beryllium wherein the ratio of titanium to beryllium is about 10:1. The alloy has an outstanding combination of useful engineering properties: mechanical strength, physical characteristics and good fabricability. A typical alloy contains, in weight percent, about 2.3 titanium, 0.2 beryllium and the balance copper plus normal impurities found in alloys of this class.

Copper-titanium-beryllium alloy

A process for producing a copper beryllium alloy. The process includes the steps of: preparing a copper beryllium melt; casting the melt; hot working the cast copper beryllium; annealing the copper beryllium; cold working the annealed copper beryllium; and hardening the copper beryllium; and is characterized by the improvement comprising the steps of: solution annealing the cold worked copper beryllium at a temperature of from 1275.degree. (691.degree.) to 1375.degree. F. (746.degree. C.); hardening the annealed copper beryllium at a temperature of from 400.degree. (204.degree.) to 580.degree. F. (304.degree. C.); cold rolling the hardened copper beryllium; and stress relief annealing the cold worked copper beryllium at a temperature of from 400.degree. (204.degree.) to 700.degree. F. (371.degree. C.). An alloy consisting essentially of, in weight percent, from 0.4 to 2.5% beryllium, up to 3.5% of material from the group consisting of cobalt and nickel, up to 0.5% of material from the group consisting of titanium and zirconium, up to 0.3% iron, up to 0.7% silicon, up to 0.3% aluminum, up to 1.0% tin, up to 3.0% zinc, up to 1.0% lead, balance essentially copper. The alloy is characterized by equiaxed grains. The grains have an average grain size of less than 9 microns. Substantially all of the grains are less than 12 microns in size.

Growing community of inventors

Sinking Spring, PA, United States of America

Sherwood Goldstein