Hoechst Celanese Corporation

Kuraray Co., Ltd.

Sherman Hall Rounsville

Randy Douglas Jester

John Arthur Penoyer

Ronald N DeMartino

Toshiaki Sato

James E Kuder

Minoru Onodera

Dominick L Cangiano

Detlef M Frank

Toru Sanefuji

Robert M Kimmel

Arnold E Wolf

Edwin Charles Culbertson

Takeichi Tsugaka

Multilayer laminates including films, sheets, preforms, containers and other articles having at least one wholly aromatic, amorphous, stretchable liquid crystalline polymer layer with at least one non-polyester thermoplastic polymer layer are provided as well as methods for producing and stretching the multilayer articles. The laminates are suitable for thermoforming and stretch blow molding applications and may be stretched at temperatures lower than the molten state of the liquid crystal polymer and at high total draw ratios without fractures or tears. Containers suitable for food or beverage products may be produced from the laminates.

Multilayer laminate formed from a substantially stretched non-molten wholly aromatic liquid crystalline polymer and non-polyester thermoplastic polymer

The invention provides a multilayer microelectronic circuit board including a laminate of a plurality of circuit layers containing conductive vias within the layers or a combination of conductive vias and conductive wiring patterns on a surface of the layers, the layers comprising a first liquid crystal polymer and, interposed between said circuit layers, a layer of second liquid crystal polymer having a melting point of at least about 10.degree. C. lower than the melting point of the first liquid crystal polymer. The boards are produced by stacking a plurality of circuit layer sheets in appropriate electrical alignment such that they are separated by an interposed layer of the second liquid crystal polymer of lower melting point, and heating the stacked polymer sheets under pressure sufficient to bond the sheets or layers into a microelectronic printed circuit board, the temperature of the heating being sufficient to melt the lower melting second polymer but insufficient to melt the polymer present in the circuit layers. The second polymer layer may be interposed as a separate sheet during assembly or may be present as one or two separate surface layers in contact with the higher melting point polymer of the circuit layers.

Monolithic LCP polymer microelectronic wiring modules

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Greenville, SC, United States of America

Sherman Hall Rounsville