International Business Machines Corporation

Globalfoundries Inc.

Sherif Ahmed Goma

Steven Alan Cordes

Matthew J Farinelli

Joanna Rosner

Gareth Geoffrey Hougham

Paul William Coteus

Alphonso Philip Lanzetta

Daniel Peter Morris

Ali Afzali

Nisha Yohannan

Keith E Fogel

Paul Alfred Lauro

George Frederick Walker

Jeannine Madelyn Trewhella

Joseph Zinter, Jr

John Ulrich Knickerbocker

Sampath Purushothaman

Paul Stephen Andry

Peter Alfred Gruber

Edmund Juris Sprogis

Carlos Juan Sambucetti

James L Speidell

Raymond R Horton

John Harold Magerlein

Leena Paivikki Buchwalter

Guy A Cohen

Aaron K Baughman

Daniel C Edelstein

Guy M Cohen

Kevin Shawn Petrarca

Richard Paul Volant

Xiao Hu Liu

Jon Alfred Casey

Bruce Kenneth Furman

Cornelia K Tsang

Jeffrey David Amsterdam

Stephen Carl Hammer

Maheswaran Surendra

Brian Richard Sundlof

Michael Wayne Lane

S Jay Chey

Chirag Suryakant Patel

Yu-Ting Cheng

Michelle Leigh Steen

Mohammed S Shaikh

Raphael Ezry

Sai Krishna Reddy Gudimetla

Gene T Patrick

Steven Allen Cordes

Simon M Karecki

Kevin Chang

Ambhighainath Ganesan

Ronald Richard Breton

Michael David Fregeau

Chelsea Grindle

Dakota Fried

One or more computer processors create a user-event localization model for an identified remote audience member in a plurality of identified remote audience members for an event. The one or more computer processors generate a virtual audience member based the identified remote audience member utilizing a trained generated adversarial network and one or more user preferences. The one or more computer processors present the generated virtual audience member in a location associated with the event. The one or more computer processors dynamically adjust a presented virtual audience member responsive to one or more event occurrences utilizing the created user-event localization model.

Dynamic virtual audience generation

A collision avoidance and road safety system is applied to a road network comprised of a plurality of road segments for a location to produce real time or dynamic forecasting of collision risk and root causes of the potential collision.

Integrated collision avoidance and road safety management system

A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including the deposition of features in close proximity to extreme topographic surfaces (e.g., deep cavities or channels) and, including the deposition of features within a cavity. In a first embodiment, the process for planarizing a cavity in a semiconductor substrate includes the application of dry film resists having high chemical resistance. In a second embodiment, the process for planarizing a cavity includes the filling of cavity using materials such as polymers, spin on glasses, and metallurgy.

Processing for overcoming extreme topography

Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.

Method of forming metallized elastomeric electrical contacts

The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

Direct edge connection for multi-chip integrated circuits

A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.

Laser release process for very thin Si-carrier build

Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described. Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and lifetime. Electrical contact regions are easily isolated and the risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. Rigid interposers include a pin projecting from a probe pad affixed to a substrate. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches down to 25 &#x3bc;m.

Interposer structures and methods of manufacturing the same

A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.

Metalized elastomeric probe structure

The invention is the technology of providing a packaging intermediate product that can serve as an interface substrate that is to be positioned between different circuitry types where the dimensions are approaching the sub 100 micrometer range. The invention involves a dielectric wafer structure where the first and second area surfaces of the wafer are separated by a distance that is of the order of the electrical via design length, and an array of spaced vias through the wafer arranged with each via filled with metal surrounded by a chemical metal deposition promoting layer with each via terminating flush with a wafer surface. The wafer structure is achieved by forming an array of blind via openings through the first surface of the dielectric wafer to a depth approaching the via design length, lining the walls for adhesion enhancement, filling the blind via openings completely with a chemically deposited metal, removing material at the first wafer surface thereby planarizing the filled vias, and removing material at the second wafer surface thereby exposing the vias at the design length.

Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer

An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.

Method for fabricating electrical contact buttons

Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.

Metalized elastomeric electrical contacts

Growing community of inventors

White Plains, NY, United States of America

Sherif Ahmed Goma