Advanced Micro-fabrication Equipment Inc. China

Shenjian Liu

Tuqiang Q Ni

Rason Zuo

Xingjian Chen

Dee Wu

Tuqiang Ni

Kui Zhao

Lei Wan

Yu Guan

Zengdi Lian

A plasma reactor having tunable low frequency RF power coupling to annular electrode. The reaction chamber has electrically conductive base connected to a low frequency RF source via RF match. An electrostatic chuck is attached to the electrically conductive base. An outer sidewall of the electrically conductive base is coated with plasma corrosion-resistance dielectric layer. A coupling ring is made of a dielectric material and surrounds an outer perimeter of the base. A focus ring is disposed above the coupling ring, the focus ring being arranged to surround the electrostatic chuck and be exposed to the plasma. The plasma reactor further comprises an annular electrode that is disposed above the coupling ring but below the focus ring, a wire having a first end electrically connected to the base, and a second end connected to the annular electrode. A variable capacitance is serially connected to the wire.

Plasma reactor having a variable coupling of low frequency RF power to an annular electrode

Embodiments of the present disclosure disclose a plasma process apparatus with low particle contamination and a method of operating the same, wherein the plasma process apparatus comprises a chamber body and a liner, wherein a dielectric window is provided above the liner; the chamber body, the liner, and the dielectric window enclose a reaction space; a base for placing a wafer is provided at a bottom portion inside the reaction space; a vacuum pump device for pumping a gas out of the reaction space and maintaining a low pressure therein is provided below the base; a shutter for shuttering between an opening on a chamber body sidewall and an opening on a liner sidewall is provided inside the chamber body, for blocking contamination particles in the gas from flowing from a transfer module to the reaction space; a groove is provided at a lower portion of the liner, wherein a flowing space enclosed by a liner outer wall below the shutter and a chamber body inner wall is in communication with an inner space of the liner via the groove to form a gas flow path, such that the contamination particles entering the flowing space are pumped away by the vacuum pump device via the gas flow path. The present disclosure may not only keep the current wafer free from being contaminated, but also may reduce contamination for a next wafer transfer; besides, it enables introduction of clean air to make the contamination particles carried out of the reaction space with a more significant effect and a higher efficiency.

Plasma process apparatus with low particle contamination and method of operating the same

Disclosed is a corrosion-resistant structure for a gas delivery system in a plasma processing apparatus. By providing a plating layer of corrosion-resistant material at the parts including the gas channel to avoid reacting with the delivered corrosive gas, metal and particle contaminations are reduced. By reversely mounting nozzles such that they reliably cover the plating layer inside the gas outlet holes, the disclosure prevents the corrosion-resistant material from being damaged by the plasma generated inside the cavity. By forming a corrosion-resistant yttrium oxide coating at the surfaces of the nozzles exposed to the cavity, the disclosure prevents the plasma from eroding the nozzles. The disclosure further leverages a flexible corrosion-resistant material, such as Teflon, to the sealing surfaces of the liner in contact with the dielectric window and the cavity, which improves the overall sealing effect of the liner. The disclosure may effectively enhance the corrosion-resistant and sealing properties of the liner and prolong its service life, as well as improving operating stability of the plasma processing apparatus.

Corrosion-resistant structure for a gas delivery system in a plasma processing apparatus

Growing community of inventors

Shanghai, China

Shenjian Liu