Dow Corning Corporation

Dow Silicones Corporation

Dow Corning Korea Ltd.

Shengqing Xu

Randall Gene Schmidt

Donald Taylor Liles

Steven Swier

Zuchen Lin

Don Lee Kleyer

Nick Evan Shephard

Lauren Marie Tonge

Dorab Edul Bhagwagar

Kent R Larson

Yanhu Wei

Kasumi Takeuchi

Adam C Tomasik

Martijn A Beukema

G M Fazley Elahee

Matt D Dowland

Daesup Hyun

Donald L Kleyer

A composition contains an aryl-functionalized polysiloxane and quaternary ammonium compound, where the quaternary ammonium compound has an anion selected from a group consisting of: halides, salicylate, octanoate, acetate, dihydrogen citrate, maleate, hydrogenglutaric acid anion, and bistartaric acid anion.

Aryl scission inhibition in aryl-functionalized polysiloxane

A silicone resin is disclosed. The silicone resin is free from carbon atoms. A method of preparing the resin is additionally disclosed. This method comprises reacting a silane compound and a precursor compound, thereby preparing the silicone resin. A composition including the silicon resin and a vehicle is further disclosed. A method of preparing a film with the composition is also disclosed. This method comprises applying the composition including the silicone resin and the vehicle to a substrate to form a layer. This method also includes heating the layer to give the film.

Silicone resin, related methods, and film formed therewith

A smart optical material characterized in that when the material is at ambient temperature (&#x2264;30&#xb0; C.), it is opaque to at least one color light in the visible light spectrum and when the material is at an elevated temperature of at least 80&#xb0; C., it is substantially transparent to the at least one color light. The smart optical material is also characterized as having before thermal aging an elongation-at-break of at least 15% and after thermal aging in air at 200&#xb0; C. for seven days an elongation-at-break that is unchanged or is at least 12% and has decreased by from &#x3e;0% to less than 50%. Also included are related formulations, methods, uses, articles and devices.

Smart optical materials, formulations, methods, uses, articles, and devices

An additive for a silicone encapsulant has the structure: Formula (I) wherein Rand Rare each &#x2014;O&#x2014;Si(R)(R)(R) and each of R, R, and Ris independently chosen from C-Chydrocarbyl groups, C-Calkyl groups, C-Calkenyl groups, and C-Caryl groups, and wherein Ris independently chosen from C-Chydrocarbyl groups, C-Calkyl groups, C-Calkenyl groups, and C-Caryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device. 

Additive for a silicone encapsulant

An aryl group-containing siloxane composition is formed by introducing an alkaline earth-metal as a part of the reaction product of an organopolysiloxane having at least two alkenyl groups per molecule and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule in the presence of a hydrosilylation catalyst, wherein at least one of the organopolysiloxanes includes an aryl group. The alkaline earth metal may be introduced via a heat stability composition or may alternatively be pre-reacted with the organopolysiloxane having at least two alkenyl groups per molecule. The aryl group-containing siloxane compositions may be utilized as an encapsulating layer for a light emitting device.

Aryl group-containing siloxane compositions including alkaline earth metal

A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIMand TIMapplications in electronic devices.

Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use

Growing community of inventors

Midland, MI, United States of America

Shengqing Xu