Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Shengqian Kong

Jiangbo Ouyang

John Gregory Woods

Hui Li

Donald E Herr

Wenhua Zhang

Bahram Issari

Yayun Liu

Stephen Hynes

Chunyu Sun

Allison Yue Xiao

Liwei Zhang

Stijn Gillissen

Sharad Hajela

Wentao Xing

Donald Herr

Jeffrey Leon

Sharon Chaplinsky

Xiaoyan Huang

Li Kang

Jeffrey Gasa

Daniel J Duffy

Dung Nghi Phan

Sarah E Grieshaber

Xiao Allison Yue

Xiao Alison Yue

Wentao Thomas Xing

Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.

Debondable compositions

Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.

Reactive resins and formulations for low refractive index and low dielectric constant applications

The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si&#x2014;H hydrogens on a silane or siloxane having terminal Si&#x2014;H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.

1K UV and thermal cure high temperature debondable adhesive

A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si&#x2014;H hydrogens on a silane or siloxane having terminal Si&#x2014;H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.

High temperature debondable adhesive

This invention is a vinylcarbosiloxane resin that is the hydrosilation reaction product of 1,3,5,7 -tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and a hydride-terminated linear polysiloxane, siloxane, or silane, having two terminal Si&#x2014;H hydrogens reactive with vinyl groups in a hydrosilation reaction, in the presence of a platinum catalyst. Suitable hydride-terminated linear polysiloxanes, siloxances, and silanes include those having the structures:  In another embodiment, the vinylcarbosiloxane resin can be reacted with one or more other hydrido-silanes and hydrido-polysiloxanes in the presence of a platinum catalyst to form a curable composition.

Vinyl carbosiloxane resins

A radiation curable temporary laminating adhesive composition for use in temperature applications at 150&#xb0; C. or greater, and typically at 200&#xb0; C. or greater, comprises (A) a hydrogenated polybutadiene diacrylate; (B) a radical photoinitiator; and (C) a diluent.

Radiation curable temporary laminating adhesive for use in high temperature applications

A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.

Wafer backside coating process with pulsed UV light source

This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.

Radiation or thermally curable barrier sealants

This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an oxetane compound and a cationic initiator.

Composition of cationic initiator and oxetane compound

This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.

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Hillsborough, NJ, United States of America

Shengqian Kong