Synaptics Corporation

Shengmin Wen

Brett Arnold Dunlap

Joseph Kurth Reynolds

Guozhong Shen

Ozan Ersan Erdogan

Yeh-Cheng Tan

Jason Goodelle

Qing Xiao

Jay Kim

A sensor assembly includes a cover layer and a first sensor apparatus. The cover layer is molded from a first material to have a planar surface and non-uniform thickness, where a thickness of the first material at a first region of the cover layer is less than a thickness of the first material surrounding the first region. The first sensor apparatus is disposed beneath the planar surface of the cover layer, within the first region. The first sensor apparatus is configured to transmit and receive first capacitive sensing signals through a portion of the planar surface coinciding with the first region. For example, the first sensor apparatus may be a fingerprint sensor configured to detect a fingerprint on the portion of the planar surface coinciding with the first region based on changes in the first capacitive sensing signals.

Fingerprint sensor housing with non-uniform thickness

A semiconductor assembly for a display device comprises a display driver integrated circuit (DDIC) chip and an interposer coupled to the DDIC chip. The DDIC chip comprises a plurality of output pads and a plurality of input pads. Further, the DDIC chip is configured to drive a plurality of data lines of the display device to update an active region of the display device. The interposer comprises a plurality of output pads coupled to the plurality of output pads of the DDIC chip and is configured to be coupled to the plurality of data lines of the display device. The interposer further comprises a plurality of input pads coupled to the plurality of input pads of the DDIC chip pads. Further, a width of the interposer is at least as large as a distance between outermost data lines of the plurality of data lines.

Interposer for a display driver integrated circuit chip

An input device for capacitive sensing includes: a plurality of sensor electrodes, the plurality of sensor electrodes comprising a plurality of transmitter electrodes and a plurality of receiver electrodes, wherein the plurality of transmitter electrodes is configured to be driven by sensing signals and the plurality of receiver electrodes is configured to receive detected signals corresponding to respective sensing signals driven onto the plurality of transmitter electrodes; a plurality of transmitter electrode vias, wherein each transmitter electrode via corresponds to a respective transmitter electrode of the plurality of transmitter electrodes; and conductive shielding, configured to mitigate effects of the plurality of transmitter electrode vias on the detected signals received on one or more receiver electrodes of the plurality of receiver electrodes, wherein the conductive shielding comprises: a first portion disposed above the plurality of transmitter electrode vias; and a second portion disposed outside the plurality of transmitter electrode vias.

Edge-effect mitigation for capacitive sensors

A sensor package and a method of forming a sensor package are disclosed. The sensor package comprises: a multilayer substrate comprising a mold compound layer and a plurality of patterned metal layers; an embedded die embedded in the multilayer substrate, wherein the mold compound layer of the multilayer substrate surrounds the embedded die; and, a sensing element disposed over the multilayer substrate, the sensing element comprising a first patterned metal layer electrically connected to the embedded die through the multilayer substrate.

Semiconductor package for sensor applications

A capacitive sensor a method of making a capacitive sensor are disclosed. The capacitive sensor includes: a plurality of rows of sensor electrodes included in a first layer; a plurality of columns of sensor electrodes included in a second layer, where the plurality of columns of sensor electrodes are arranged orthogonally to the plurality of rows of sensor electrodes to form a two-dimensional sensing array; and, a plurality of conductive elements included in a third layer disposed between the first and second layers, wherein, for each conductive element of the plurality of conductive elements, a first end of the conductive element is electrically connected to a sensor electrode in the plurality of rows of sensor electrodes and a second end of the conductive element is capacitively coupled to a sensor electrode in the plurality of columns of sensor electrodes to form a trans-capacitive sensing pixel of the two-dimensional sensing array.

Growing community of inventors

Phoenix, AZ, United States of America

Shengmin Wen