Dow Silicones Corporation

Dow Silicones Corportation

Dow Silicones Corpoation

Dow Toray Co., Ltd.

Shenglan Zhang

Zhihua Liu

Kazuhiro Nishijima

Jingui Jiang

Wenjie Chen

Qing Cao

Jiayin Zhu

Hidefumi Tanaka

Fuming Huang

Chao Ma

Chengrong Zhu

A curable composition contains: (A) a polydiorganosiloxane component including: (A1) greater than 3.1 wt % to 20 wt % of an aliphatically unsaturated polydiorganosiloxane polymer and (A3) a hydroxyl-terminated polydiorganosiloxane gum of unit formula (A-III); (B) a polyorganosilicate resin component including (B1) a capped resin, (B2) >18.53 wt % to 54.3 wt % of an uncapped resin; where the weight ratio of the uncapped resin (B2) to the capped resin (B1) is greater than 0.51 to 58.82; where component (A) and component (B) are present in amounts to provide a weight ratio of (B):(A) of 1.2:1 to less than 1.62:1; (C) a polyorganohydrogensiloxane that is present in an amount to provide a molar ratio of silicon bonded hydrogen atoms to alkenyl groups for the curable composition of 5 to 50; (D) a hydrosilylation reaction catalyst in an amount sufficient to provide 1 to 1000 ppm of platinum group metal; and (E) a condensation reaction catalyst; where the content of alkenyl groups in the curable composition is 0.017 wt % to 0.089 wt %; and where wt % values are relative to the total weight of components (A), (B), (C), (D) and (E) unless otherwise stated.

Curable composition for silicone pressure sensitive adhesives

An (A) additive organopolysiloxane composition is disclosed, which includes (A1) a branched organopolysiloxane polymer comprising M, D and Q siloxy units, (A2) a silicone resin, and (A3) a polydiorganosiloxane oligomer. A curable composition is also disclosed, the curable composition including the (A) additive organopolysiloxane composition, (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule, and (C) a hydrosilylation catalyst. A method of preparing the curable composition, and a method of forming a film with the curable composition are also disclosed. The compositions and methods are useful for forming silicone release coatings with high release force.

Additive organopolysiloxane composition, curable composition, and film

A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

Anchorage additive and methods for its preparation and use

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Shanghai, China

Shenglan Zhang