Hon Hai Precision Industry Co., Ltd.

Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Fu Zhun Precision Ind. (shenzhen) Co., Ltd.

Shenghua Wang

Cheng-Tien Lai

Tsung-Lung Lee

Li He

Dong Wang

Zhi-Gang Liu

Tsung Lung Lee

Jian-Hua Gu

A heat pipe includes an outer pipe (), an inner pipe (), and a hermetic cap (). The outer pipe has an evaporating end () and a condensing end (). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap () is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.

Heat pipe incorporating outer and inner pipes

A liquid-cooled heat sink assembly for cooling down an electronic component includes a main body () defining a central chamber () therein and having a number of fins () on an outside thereof, liquid coolant received in the central chamber, a first fan () received in the central chamber, and a second fan () positioned over the main body and engaged with the first fan. The heat sink assembly couples forced liquid cooling and forced airflow cooling, and need not extra pipes to form a circuit for the liquid coolant. Thus, not only the volume of the heat sink assembly is lessened, but also facilitates matching with electronic components.

Liquid-cooled heat sink assembly

A heat dissipation device ( ) includes a heat sink ( ), a number of first pipes ( ), a pair of second pipes ( ), and working liquid. The heat sink includes a base ( ), and a number of fins ( ) attached on the base. A number of parallel first holes ( ) is defined through the base. A second hole ( ) is defined through a middle of the base in a longitudinal direction that is perpendicular to the first holes. The first and second pipes and the first and second holes thus cooperatively form a closed circulatory route. The working liquid is received in the circulatory route. In operations the working liquid absorbs heat at the base and circulates through the circulatory route. The first and second pipes dissipate said heat to airspace beyond the fins. Accordingly, the first and second pipes increase a heat dissipation area of the heat dissipation device.

Heat dissipation device with working liquid received in circulatory route

A fan holder ( ) for mounting a fan ( ) to a heat sink ( ) includes a rectangular base ( ). The base is attached to the heat sink, and supports the fan thereon. An opening ( ) is defined in the base, for providing airflow access from the fan to the heat sink. A pair of tabs ( ) depends from each of opposite sides of the base. Each pair of tabs is disposed at respective opposite ends of the respective side of the base. A stop ( ) integrally extends from each tab, the stop engaging in a corresponding slot of the heat sink. A handle ( ) integrally extends from each tab, for facilitating manual operation whereby the tab is moved resiliently. In a preferred embodiment, each stop is orthogonal to both the tab and the base. In an alternative embodiment, each stop is orthogonal to the tab and parallel to the base.

Fan holder for heat sink

A heat dissipation device includes a vaporizing portion ( ), a condensing portion ( ), and a pair of pipes ( ). The vaporizing portion is attached to a heat-generating electronic chip ( ) and contains liquid having great heat conductivity. The condensing portion receives vapor from the vaporizing portion, and cools the vapor to back to liquid form. The pipes are engaged with the vaporizing portion and the condensing portion, thus forming a circulatory route for the vapor from the vaporizing portion to the condensing portion, and for the liquid from the condensing portion to the vaporizing portion.

Heat dissipation device

A mounting assembly for securing a heat sink ( ) to an electronic package ( ) mounted on a circuit board ( ) includes a back plate ( ), a clip ( ), and two screws ( ). The back plate abuts an underside of the circuit board. The back plate includes a cross-shaped main body ( ), and two first positioning posts ( ) and two second positioning posts ( ). An annular groove ( ) and a threaded hole ( ) are defined in each first and each second positioning post respectively. The clip includes a horizontal portion ( ), and two first legs ( ) and two second legs ( ). A guiding hole ( ) and a communicating positioning slot ( ) are defined in each first leg, the positioning slot engagingly receiving a corresponding first positioning post. A fastening slot ( ) is defined in each second leg. The screws are inserted through the fastening slots into the corresponding threaded holes.

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Shenzhen, China

Shenghua Wang