Nanchang O-film Tech. Co., Ltd.

Shenzhen O-film Tech. Co., Ltd.

Suzhou O-film Tech Co., Ltd.

International Business Machines Corporation

Jrd Communication (shenzhen) Ltd.

Shenzhen Cemotion Trading Co., Ltd.

Nangchang O-film Tech Co., Ltd.

Huawei Technologies Co., Limited

Sheng Zhang

Feng Zhang

Yulong Gao

Shengbo Guo

Ying Gu

Yunliang Yang

Linlang Wu

Yuanfeng Ma

Zhihao Zheng

Fei Zhou

Hongwei Kang

Peiting Ma

Chunming Chen

Xingliang Diao

Gao Yulong

Disclosed is a double-path switching TX power detection circuit. A first detection module is separately connected to a power supply, a first radio frequency connector, and a second radio frequency connector; a second detection unit is connected to the second radio frequency connector; the first detection module and the second detection module control a current path of the power supply according to access states of the first radio frequency connector and the second radio frequency connector, respectively; the first detection module outputs a corresponding detection level signal, to determine whether a switching TX power function is enabled or disabled.

Double-path switching TX power (SWTP) detection circuit and apparatus, and mobile terminal

Night light

The present invention provides a substrate double-surface hole-filling apparatus for carrying out a hole-filling operation on a substrate which has a first surface and a second surface, comprises a first feeding device, a first scraping device, a first drying device, a second feeding device, a second scraping device, a second drying device and a turnover device. The substrate double-surface hole-filling apparatus has a turnover device turning over the substrate which needs to be carried out with hole-filling operation. Therefore, the substrate double-surface hole-filling apparatus can automatically carry out the hole-filling operation on two surfaces of the substrate without manual turnover of the substrate, thus improving production efficiency.

Apparatus for substrate double-surface hole-filling

The present invention provides a single-layer multi-point touch-control conductive film and a method for producing the same. The single-layer multi-point touch-control conductive film includes a transparent substrate having a first surface; a bridging module provided on the first surface of the transparent substrate; a transparent polymer layer provided on the first surface of the transparent substrate, the transparent polymer layer covers the bridging module; the transparent polymer layer is formed with a first groove-like grid on the surface, the first groove-like grid is filled with a conductive material, respectively forming a first electrode and a plurality of second electrode modules, the bridging module electrically connects two adjacent second electrode modules, to form a second electrode; and a conductive module, provided on the transparent polymer layer, and penetrating the transparent polymer layer; each of the second electrode modules is in electrical connection with the bridging module via the conductive module.

Single-layer multi-point touch-control conductive film

A high speed polishing device useful for polishing a large number of miniature components, such as multi-layer electronic components, is disclosed. In various embodiments of the present invention, a vertical planetary ball mill or other barrel polishing device is modified to rotate polishing containers having a modified interior cavity structure. This interior cavity provides a smooth, gradually curved interior sidewall that improves circulation within the container during high-speed vertical polishing rotation. The improved circulation results in polishing for a larger number of components placed within the container and in less time than existing polishing container structures. In further embodiments, the containers are rotated around a generally tilted axis positioned at an angle between entirely vertical and horizontal positions. Rotation about a tilted axis further reduces collisions and increases relative polishing movement within the container.

High speed barrel polishing device

A conductive film includes a transparent insulating substrate and a conductive mesh formed on the transparent insulating substrate, one of them is imprinted to form a meshed-like grooves on a surface thereof, it is simple and quick, having high efficiency; the grooves is printed and filled with metal slurry and sintered to form a conductive mesh, the cost is low; the distance between the lines of the conductive mesh is defined as d, 100 &#x3bc;m&#x2266;d&#x3c;600 &#x3bc;m, the square resistance of the conductive mesh is defined as R, 0.1 &#x3a9;/sq&#x2266;R&#x3c;200 &#x3a9;/sq. In order to reduce the distance between the line, the width of the mesh line is reduced, thereby improving the light transmission of the conductive film; the smaller the square resistance, the better the conductivity of the conductive film, the faster the transmission speed of the signal; the lower metal content ensure the small square resistance, saving raw materials.

Conductive film and preparation method thereof

A flexible circuit connecting device is disclosed, including a base layer having a first surface and a second surface, and conductive traces having a grid-like structure and formed on the first surface and/or the second surface. The conductive traces of the above flexible circuit connecting device are nearly aligned with the base layer, and thus the probability of damage under a stress is reduced. Designed to be a grid-like structure, the conductive traces become more transparent, while satisfying a function of a connector. Besides, the above flexible circuit connecting device has a high density circuit trace, so that the size of the connector can be reduced and the interior space of the electronic components can be saved. In a manufacture process of the above flexible circuit connecting device, the manufacture process can be simplified, manufacture efficiency and production yield can be improved, and manufacture cost can be efficiently reduced.

Flexible circuit connecting device

A transparent conductive film includes a transparent substrate and a polymer layer formed on the transparent substrate, a surface of the polymer layer is patterned to define a meshed trench, the meshed trench is filled with a conductive material to form a sending area, a periphery of the sensing area is printed with a lead, the lead is electrically connected to the conductive material in the meshed trench. Besides, a method of manufacturing the transparent conductive film is provided. In the transparent conductive film and the method, the trench is filled with a conductive material to form a sending area, and the lead is formed by printing and electrically connected to the conductive material, the yield of the lead of the transparent conductive film is relatively high.

Transparent conductive film and preparation method thereof

A method useful for polishing a large number of miniature components such as multi-layer electronic components, within a high speed barrel polishing device, is disclosed. In various embodiments of the present invention, a vertical planetary ball mill or other barrel polishing device is modified to rotate polishing containers having a modified interior cavity structure. This interior cavity provides a smooth, gradually curved interior sidewall that improves circulation within the container during high-speed vertical polishing rotation. The improved circulation results in polishing for a larger number of components placed within the container and in less time than existing polishing container structures. In further embodiments, the containers are rotated around a generally tilted axis positioned at an angle between entirely vertical and horizontal positions. Rotation about a tilted axis further reduces collisions and increases relative polishing movement within the container.

Growing community of inventors

Shenzhen, China

Sheng Zhang