Cheng Uei Precision Industry Co., Ltd.

Silicon Motion, Inc.

National Taipei University of Technology

Sheng-Yuan Huang

Yung-Chi Peng

Pei-Yi Lin

Te-Hung Yin

Han-Wei Wang

Chun-Fu Lin

Sheng-Nan Yu

Yi-Ching Hsu

Yu-Hung Su

Yun-Chien Lee

Chung-Yu Chen

Yu-Ping Chang

Chung-Hsin Huang

Sheng-Tsung Yuan

Syang-Peng Rwei

Chuan-Hung Lin

Tzu-Wei Chou

Wen-Wu Tseng

An electrical connector includes an insulating housing, an upper terminal assembly fastened in the insulating housing, a center grounding plate fastened in the insulating housing, and an outer shell disposed to a top surface of the insulating housing. A rear end of the insulating housing has two first penetrating grooves. The upper terminal assembly includes an upper base portion. A rear end of the upper base portion defines two second penetrating grooves. The two second penetrating grooves are aligned with the two first penetrating grooves. Two opposite sides of a rear end of a top surface of the outer shell extend towards the insulating housing to form two elastic arms, respectively. The two elastic arms pass through the two first penetrating grooves and the two second penetrating grooves, and then the two elastic arms contact with two outermost upper grounding terminals of the upper terminal assembly.

Electrical connector with high-frequency signal transmission

A high-speed connector includes an insulating housing, a first terminal assembly received in the insulating housing, a second terminal assembly received in the insulating housing, a third terminal assembly received in the insulating housing, and a fourth terminal assembly received in the insulating housing. The second terminal assembly is opposite to the first terminal assembly along an up-down direction. The third terminal assembly is disposed between the first terminal assembly and the second terminal assembly. The fourth terminal assembly is corresponding to the third terminal assembly. The fourth terminal assembly is disposed between the second terminal assembly and the third terminal assembly.

High-speed connector

An electrical connector includes an insulating body, a plurality of conductive terminals, a plurality of grounding terminals and two shielding elements. The plurality of the conductive terminals are mounted in the insulating body. The plurality of the grounding terminals are mounted in the insulating body. The plurality of the grounding terminals are located adjacent to two outer sides of the plurality of the conductive terminals. The two shielding elements are disposed at a front end of an upper surface and a front end of a lower surface of the insulating body. Each shielding element has a base frame. Two sides of a rear edge of the base frame are connected with two contact portions. The contact portions of the two shielding elements contact with the plurality of the grounding terminals.

Electrical connector

Metal sheet

A data storage device, and an error tolerance selecting method thereof which includes: writing data to data blocks of the data storage device; reading written data of the data blocks as read data; comparing the read data and the written data of each data column in the data blocks, and calculating a number of error bits in each chunk including a plurality of data columns accordingly; calculating a difference value between the number of error bits in the chunk and a first threshold value to store the difference value in an error tolerance list; and selecting a largest difference value in the error tolerance list as an error tolerance.

Data storage device and error tolerance selecting method thereof

A high-speed connector includes an insulating housing, and a first terminal assembly mounted in the insulating housing. The first terminal assembly includes a plurality of first terminals, a first base body and a first conductive film. The plurality of the first terminals include at least two first grounding terminals and at least two first signal terminals. At least one portion of a bottom of the first base body extends downward to form at least one first protruding portion. The at least two first signal terminals penetrate through the at least one first protruding portion. The first conductive film is covered to the at least one first protruding portion. The first conductive film has a first metal layer. The first metal layer is electrically connected with the at least two first grounding terminals to form a grounding structure.

A selecting bad data column method suitable for a data storage device is provided. The data storage device includes a control unit and a data storage medium. The selecting method performed by the control unit includes: reading written data of each data column as read data; comparing the read data and the written data of each data column to calculate an average number of error bits of each data column; determining whether the average number of error bits of each data column is greater than or equal to a predetermined value; and recording a data column as a bad data column when the average number of error bits of the data column is greater than or equal to the predetermined value. In this way, in order to avoid the problems that the error correction code can't be corrected or the correction capability is excessively consumed.

Data storage device and selecting bad data column method thereof

A data storage device and a selecting bad data block method thereof which includes: writing data to a sample block; reading written data of the sample block as read data; comparing the read data and the written data of each data column in sample block, and calculating a number of error bits in each chunk accordingly; selecting a column with the largest number of error bits in a chunk with the largest number of error bits as a bad data column; and recording the sample block as a bad data block when determining that the number of error bits in the chunk is greater than or equal to the first threshold value and the number of bad columns in the chunk is greater than or equal to the second threshold value.

Data storage device and selecting bad data block method thereof

A high-speed connector includes an insulating housing, and a first terminal assembly mounted in the insulating housing. The first terminal assembly includes a plurality of first terminals including a plurality of first grounding terminals, a first base body, and a first shielding plate disposed under the first base body. The plurality of the first terminals are fastened to the first base body. The first shielding plate has a first base plate, a first metal layer and a plurality of first ribs. Several portions of a top surface of the first base plate extend upward to form the plurality of the first ribs. The first metal layer is a pattern with a plurality of pores. Several of the first grounding terminals contact with the first metal layer which is attached to top surfaces of the plurality of the first ribs to form a grounding structure.

A flash memory initialization method executed by a flash memory initialization device to initialize a flash memory device having a flash memory and a flash memory controller includes: determining an acceptable maximum number N of candidate addresses; determining a number M of different capacity sizes; classifying the candidate addresses into M portions; determining a difference value between two address values of any two adjacent addresses among the m-th portion of candidate addresses; determining multiple address values of the m-th portion of candidate addresses according to the difference value; and determining actual addresses of the m-th portion of candidate addresses according to the multiple address values; and controlling the flash memory controller to write the boot up information into at least one storage location corresponding to at least one of the m-th portion of candidate addresses according to the actual addresses.

Flash memory initialization scheme for writing boot up information into selected storage locations averagely and randomly distributed over more storage locations and correspondingly method for reading boot up information from selected storage locations

A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer. The plurality of electronic devices are disposed on the plurality of circuit boards, and each is electrically connected to a corresponding one of the plurality of circuit boards.

Twistable electronic device module

A plane selection method is provided, which is applied to a data storage medium including a plurality of planes, wherein each of the planes includes a plurality of blocks, each of the blocks includes a plurality of pages, and each of the pages which includes a plurality of data columns is divided into a plurality of chunks. The plane selection method includes steps of defining at least one data column having a largest number of error bits in a worst chunk as a bad column until a quantity of bad columns is used up, determining whether at least two planes are uncorrectable according to a distribution of the bad columns, and eliminating a record of the bad columns and banning a worse plane which had the most bad columns than other planes.

Data storage device and plane selection method thereof

A method for selecting bad columns in a data storage medium is provided. The data storage medium is coupled to a control unit, and the data storage medium includes data blocks, wherein each of the data blocks includes columns. The columns are divided into chunks. The method for selecting bad columns in the data storage medium includes following steps. (a) The control unit calculates a number of bad columns in each of the chunks to sorts the chunks, wherein the bad columns are selected from the columns. (b) The control unit sequentially marks or records the bad columns in each of the chunks with bad column groups, wherein a bad column position and a bad column number in each of the chunks are marked or recorded in each of the bad column groups.

Method for selecting bad columns in data storage medium

A method used by a flash memory initialization device for writing boot up information into a memory device including a controller and a flash memory includes: generating the boot up information; generating N block indices by calling a random function based on a first seed; generating M page indices for each of the N block indices; combining the M page indices with each of the N block indices to generate M&#xd7;N candidate row addresses; and writing the boot up information from the flash memory initialization device into the flash memory by controlling the controller to write the boot up information into M pages belonging to at least one block sequentially based on the M&#xd7;N candidate row addresses.

Flash memory initialization scheme for writing boot up information into selected pages averagely and randomly distributed over more pages and correspondingly method for reading boot up information from selected pages

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Taipei, Taiwan

Sheng-Yuan Huang