Taimide Technology Incorporation

Taimide Technology Incorporated

Sheng-Yu Huang

Chung-Yi Chen

Chun-Ting Lai

Yen-Po Huang

Paul S C Wu

The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.

Fabrication of a flexible circuit board

A process of manufacturing a white polyimide film comprising performing condensation polymerization of monomers comprising diamine and dianhydride components to obtain a solution; adding a dehydrant, a catalyst and a coloration filler into the solution to obtain a precursor solution; coating a layer of the precursor solution on a support; and baking the coated layer of the precursor solution to form a white polyimide film. The diamine component can include 2,2'-bis(trifluoromethyl)benzidine, and the dianhydride component can include 3,3&#x2032;,4,4&#x2032;-biphenyltetracarboxylic dianhydride and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride. The coloration filler can include TiO, AlO, CaCO, CaSO, SiO, BN, AlN and clay.

White polymide film and manufacture thereof

A white polyimide film comprises a polyimide base polymer and a coloration filler homogeneously distributed in the white polyimide film by reacting a diamine component with a dianhydride component and a coloration filter. The diamine component can include 2,2'-bis(trifluoromethyl)benzidine, and the dianhydride component can include 3,3&#x2032;,4,4&#x2032;-biphenyltetracarboxylic dianhydride and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride. The coloration filler can include TiO, AlO, CaCO, CaSO, SiO, BN, AlN and clay. The white polyimide film has a coefficient of thermal expansion (CTE) less than about 60 ppm/&#xb0; C. in a temperature range between about 100&#xb0; C. and about 200&#xb0; C. , an elongation rate between about 5% and about 60%, and a b*-value between about 0 and about 15. In some embodiments, a method of manufacturing the white polyimide film is also described.

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Hsinchu Hsien, Taiwan

Sheng-Yu Huang