Chang Chun Plastics Co., Ltd.

Tsinghua University

Sheng Yen Wu

Kuen Yuan Hwang

An Pang Tu

Chen-Chi Martin Ma

Jen Fu Wang

Siu-Ming Yuen

Chia-Yi Chuang

Kuo-Chi Yu

Gai Chi Chen

Yu Lin Huang

Ching Jui Huang

The present invention relates to a novel water soluble polyimide resin, which contains a hydrophilic functional group such as &#x2014;OH, &#x2014;COOH to increase the solubility of the polyimide resin in alkali aqueous solution, and is suitable for using as an insulation film in electronic and photoelectric products. The present invention also relates to preparation and use of the above polyimide.

Water soluble polyimide resin, its preparation and use

A method of preparing carbon nanotube/polymer composite having electromagnetic interference (EMI) shielding effectiveness is disclosed, which includes: dispersing multi-walled carbon nanotubes (MWCNT) in an organic solvent such as N,N-Dimethylacetamide (DMAc); dissolving monomers such as methyl methacrylate (MMA) and an initiator such as 2,2-azobisisobutyronitrile (AIBN) in the MWCNT dispersion; and polymerizing the monomers in the resulting mixture at an elevated temperature such as 120&#xb0; C. to form a MWCNT/PMMA composite. The composite is coated onto a PET film, and the coated PET film alone or a stack of multiple coated PET films can be applied as an EMI shielding material.

Method of preparation of a MWCNT/polymer composite having electromagnetic interference shielding effectiveness

The present invention relates to a water soluble photosensitive polyimide polymer, preparation thereof and a photoresist composition containing the same. The water soluble photosensitive polyimide polymer is characterized by having repeat units represented by the following formula (I): the other symbols are defined in the specification].

Water soluble photosensitive polymide polymer, its preparation and photoresist containing the same

A polyimide resin composition modified with bismaleimide and cyanate, which comprises (a) polyimide resin, (b) cyanate, (c) bismalemide, and (d) nanometer filler. By using the present polyimide resin composition modified with bismalemide and cyanate, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved, and thus it is suitable for cladding with copper foil to produce printed circuit board.

Polymide resin composition modified with bismaleimide and cyanate

The present invention relates to a flame-retarding epoxy resin composition containing no halogen, which comprises an epoxy resin containing no halogen, a toughening agent, and a flame retarding agent. The present flame-retarding epoxy resin composition exhibits a high heat-resistance and excellent adhesion and is useful as adhesive agent in flexible printed circuit board.

Growing community of inventors

Hsinchu, Taiwan

Sheng Yen Wu