Taiwan Semiconductor Manufacturing Comp. Ltd.

Industrial Technology Research Institute

Sheng-Wei Lee

Ming-Te Chen

Shao-Hua Wang

Chee-Wee Liu

Lih-Juann Chen

Pang-Shiu Chen

Jong-I Mou

Po-Feng Tsai

Kao-Feng Liao

Chia-Tong Ho

Jo-Fei Wang

Chia-Hsing Liao

An ion implantation apparatus and a method for ion implantation provides for implanting multiple substrates simultaneously. The different substrates are on corresponding platens within an ion implantation chamber or they may be positioned on separate substrate holders on a single oversized platen. The substrates and platen or platens, are translatable with respect to an ion beam, the individual substrates are rotatable and the position of the substrates relative to one another in the ion implantation chamber are movable. By rotating, translating and repositioning substrates during the ion implantation process, the entirety of all substrates are implanted by an ion beam even when the ion beam has a relatively small footprint and a relatively short scan length, compared to the diameters of the substrates undergoing implantation.

Multi-platen ion implanter and method for implanting multiple substrates simultaneously

A system, a method, and a non-transitory computer readable storage medium for controlling an ion implanter are disclosed herein. The system includes a sample module and a control module. The sample module is configured to generate a summarized value from process data of the ion implanter, and the process data correspond to a control parameter. The control module is configured to tune a control parameter, and the control module performs an ion implantation by releasing tools of the ion implanter in accordance with the control parameter when the summarized value meets a predetermined stability requirement.

System and method for controlling ion implanter

An ion beam generator includes a plurality of arc chambers, wherein each arc chamber of the plurality of arc chamber is integral with every arc chamber of the plurality of arc chambers. The ion beam generator further includes a plurality of extraction slits, wherein each extraction slit of the plurality of extraction slits is configured to extract ions from a corresponding arc chamber of the plurality of arc chambers. The ion beam generator further includes a plurality of arc slits, wherein each arc slit of the plurality of arc slits is configured to provide an ion path between a corresponding extraction slit of the plurality of extraction slits and the corresponding arc chamber of the plurality of arc chambers.

Ion beam generator, ion implantation apparatus including an ion beam generator and method of using an ion beam generator

An ion implantation tool includes a process chamber, a platen, an ion source, and a plurality of controlling units. The platen is present in the process chamber and configured to hold a wafer. The ion source is configured to provide an ion beam onto the wafer. The controlling units are present on the platen and configured to apply a plurality of physical fields that are able to affect motions of ions of the ion beam onto the wafer.

Ion implantation tool and ion implantation method

An ion implantation method includes generating a first ion beam and a second ion beam, the first ion beam having a different configuration from the second ion beam. The method further includes scanning and directing the first ion beam along a first path toward a workpiece to perform ion implantation on the workpiece. The method alternatively includes directing the second ion beam along a second path toward the workpiece to perform ion implantation on the workpiece. The first path is different from the second path.

Processing apparatus, ion implantation apparatus and ion implantation method

A processing apparatus includes an end station configured to support thereon a workpiece, an ion beam generator and a scanning device. The ion beam generator is configured to generate an ion beam toward the end station. The scanning device is configured to scan the ion beam in a transverse scanning direction. The scanning device is configured to be disposed in a first path of the ion beam toward the end station and out of a second path of the ion beam toward the end station.

Processing apparatus and ion implantation apparatus

A method for growing strained Si layer and relaxed SiGe layer with multiple Ge quantum dots (QDs) on a substrate is disclosed. The method can reduce threading dislocation density, decrease surface roughness of the strained silicon and further shorten growth time for forming epitaxy layers than conventional method. The method includes steps of: providing a silicon substrate, forming a multiple Ge QDs layers; forming a layer of relaxed SiGe; and forming a strained silicon layer in subsequence; wherein x is greater than 0 and less than 1.

Strained silicon forming method with reduction of threading dislocation density

A construction of thin strain-relaxed SiGe layers and method for fabricating the same is provided. The construction includes a semiconductor substrate, a SiGe buffer layer formed on the semiconductor substrate, a Si(C) layer formed on the SiGe buffer layer, and an relaxed SiGe epitaxial layer formed on the Si(C) layer. The Si(C) layer is employed to change the strain-relaxed mechanism of the relaxed SiGe epitaxial layer formed on the Si(C) layer. Therefore, a thin relaxed SiGe epitaxial layer with low threading dislocation density, smooth surface is available. The fabricating time for fabricating the strain-relaxed SiGe layers is greatly reduced and the surface roughness is also improved.

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Hsinchu, Taiwan

Sheng-Wei Lee