Industrial Technology Research Institute

Au Optronics Corporation

Chunghwa Picture Tubes, Ltd.

Hannstar Display Corporation

Taiwan Tft Lcd Association

Chi Mei Optoelectronics Corporation

Tpo Displays Corporation

Toppoly Optoelectronics Corporation

Quanta Display Inc.

Chimei Innolux Corporation

Tpo Dispalys Corp.

Sheng-Shu Yang

Shyh-Ming Chang

Wen-Chih Chen

Chao-Chyun An

Yuan-Chang Huang

Ming-Yao Chen

Hsiang-Hung Chang

Ngai Tsang

Hsiao-Ting Lee

An image sensor including a substrate, an image sensing element, and an adhesive layer is provided. The substrate has an arc surface. The image sensing element is disposed on the arc surface and curved to fit the contour of the arc surface. The adhesive layer is disposed on the arc surface and encapsulates the image sensing element.

Image sensor

A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening.

Bonding inspection structure

A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.

Contact structure and forming method thereof and connecting structure thereof

A method of fabricating a bonding structure having compliant bumps includes first providing a first substrate and a second substrate. The first substrate includes first bonding pads. The second substrate is disposed on one side of the first substrate and includes second bonding pads and compliant bumps disposed thereon. The second bonding pads are opposite to the first bonding pads. Next, a non-conductive adhesive layer and ball-shaped spacers are formed between the first and the second substrates. Finally, the first substrate, the non-conductive adhesive layer, and the second substrate are compressed, such that the compliant bumps on the second bonding pads of the second substrate pass through the non-conductive adhesive layer and are electrically connected to the first bonding pads of the first substrate, respectively. The ball-shaped spacers are distributed in the non-conductive adhesive layer sandwiched between the first and the second substrates for maintaining the gap therebetween.

Method of fabricating bonding structure

A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced.

Flip chip device and manufacturing method thereof

A contact structure having both a compliant bump and a testing area and a manufacturing method for the same is introduced. The compliant bump is formed on a conductive contact of the silicon wafer or a printed circuit board. The core of the bump is made of polymeric material, and coated with a conductive material. In particular, the compliant bump is disposed on the one side of the conductive contact structure that includes both the bump and the testing area, wherein the testing area allows the area to be functionality tested, so as to prevent damage of the coated conductive material over the compliant bump during a probe testing.

Contact structure having a compliant bump and a testing area

A bonding structure including a first substrate, a second substrate, a non-conductive adhesive layer, and ball-shaped spacers is provided. The first substrate has first bonding pads. The second substrate is disposed on one side of the first substrate, and includes second bonding pads and compliant bumps disposed on the second bonding pads, respectively. The second bonding pads on the second substrate are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively. The non-conductive adhesive layer is sandwiched between the first substrate and the second substrate. The ball-shaped spacers are distributed in the non-conductive adhesive layer to maintain the gap between the first and second substrates.

Bonding structure

A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.

Bond quality indication by bump structure on substrate

A bonding structure with compliant bumps includes a stopper structure and a protection layer. Compliant bumps include at least a polymer bump, a metal layer and a surface conductive layer. Both the stopper structure and protection layer are formed with polymer bumps and metal layer. Compliant bumps provide bonding pad and conductive channel. Stoppers are used to prevent compliant bumps from crushing for overpressure in bonding process. The protection layer provides functions of grounding and shielding. The stoppers can be outside or connected with the compliant bumps. The protection layer has thickness smaller than the stopper structure and compliant bumps. It can be separated or connected with stoppers.

Growing community of inventors

Hsinchu, Taiwan

Sheng-Shu Yang