Innolux Corporation

Sheng-Nan Chen

Kuang-Ming Fan

Chin-Lung Ting

I-Chang Liang

Po-Wen Lin

Chih-Chiang Chang Chien

Tai-Chi Pan

Kuan-Feng Lee

Jui-Jen Yueh

Ker-Yih Kao

Chia-Lin Yang

Chin-Ming Huang

Kuo-Sheng Yeh

An electronic device includes an electronic unit, a circuit layer and a bonding pad. The electronic unit includes a chip, an insulating layer and a first conductor layer. The insulating layer is disposed on the chip, the insulating layer includes a first opening, and the first conductor layer is disposed in the first opening. The circuit layer is disposed corresponding to the electronic unit, and the circuit layer includes a second opening and a second conductor layer disposed in the second opening. The bonding pad is in contact with the second conductor layer, and the bonding pad is electrically connected to electronic unit. The first conductor layer has a first height, the second conductor layer has a second height, and a ratio of the first height to the second height is greater than or equal to 0.1 and less than or equal to 0.9.

Electronic device

An electronic device is provided. The electronic device includes a plurality of spacing elements, a first electronic unit and a second electronic unit, a protective layer and a connecting member. The first electronic unit and the second electronic unit are individually disposed between two adjacent spacing elements. The protective layer surrounds the spacing elements, the first electronic unit and the second electronic unit. The first electronic unit is electrically connected to the second electronic unit via the connecting member. In a direction that is perpendicular to a normal direction of the electronic device, the first electronic unit has a first width, and a first distance is between the two adjacent spacing elements. A ratio of the first distance to the first width is greater than or equal to 1 and less than or equal to 1.3. A method of manufacturing an electronic device is also provided.

Electronic device and method of manufacturing the same

A method of forming an electronic device including: providing an assembly, wherein the assembly includes a substrate, an optical film, a plurality of color filters and a defect, wherein the plurality of color filters and the defect are disposed between the substrate and the optical film; and using a laser pulse to form a first processed area that corresponds to the defect in the optical film, wherein the first processed area at least partially overlaps at least two of the plurality of color filters.

Method of forming electronic device

An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.

Electronic device and method of forming the same

An electronic device is disclosed. The electronic device includes a panel, a defect in and/or on the panel and an optical film above the panel. The panel includes a first substrate, a second substrate disposed opposite to the first substrate, and a plurality of display units disposed on the first substrate. There is a defect between the first substrate and the second substrate, or on the second substrate. In a top view of the electronic device, an optical film has a first processed area corresponding to the defect, and the first processed area at least partially overlaps at least two display units.

Growing community of inventors

Miao-Li County, Taiwan

Sheng-Nan Chen