Siliconware Precision Industries Co., Ltd.

Sheng-Ming Yang

Chi-Liang Shih

Chih-Hsien Chiu

Chia-Yang Chen

Tsung-Hsien Tsai

Wen-Jung Tsai

Hsin-Lung Chung

Te-Fang Chu

Yu-Wei Yeh

Hung-Cheng Chen

Ping-Hung Liao

An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

Electronic package

A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.

Semiconductor package and fabrication method thereof

Growing community of inventors

Taichung, Taiwan

Sheng-Ming Yang