Taiwan Semiconductor Manufacturing Comp. Ltd.

Sheng-Liang Pang

Chih-Kung Chang

Kuo-Liang Lu

Chih-Tien Chang

Newton Wang

Bii-Jung Chang

The present invention provides an improved apparatus and method for removing condensates, such as chlorides, from a dry etch, vacuum effluent stream. Dry etching of metallizations under vacuum conditions, using RF plasma and other techniques, is used in the processing of semiconductor devices and other applications. The apparatus and method remove accumulated chloride deposits that would otherwise restrict and ultimately plug the pipe that carries the vacuum effluent stream. The present invention utilizes an inner tube that is placed on the interior of the pipe and magnetically coupled to an outer tube that surrounds the exterior of the pipe. Translation of the outer tube causes translation of the inner tube, thereby removing accumulated condensate from the pipe. The apparatus may be configured so as to sense the accumulation of the condensate and automatically actuate the apparatus to remove the accumulated condensate.

Apparatus and method for removing condensate from pipes

Pigment-based resists tend to give off a certain amount of organic vapor during exposure. This brings about contamination of the projection lens surface as well as other parts of the system. A method to monitor this accumulation of solvent vapor on the lens surface is disclosed, based on a test matrix (in which exposure time and focal distance are systematically varied) through which a series of images are formed in the resist and then evaluated for quality. A key feature is the test patterns that are used for forming the images. Said patterns are designed so as to maximize the total amount of diffraction that occurs during image formation, thereby maximizing sensitivity to changes in lens quality. Several examples of the test patterns are provided.

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Hsinchu, Taiwan

Sheng-Liang Pang