Powerchip Technology Corporation

Sheng-Hsiu Peng

Chien-Chung Chen

Jyun-Da Wu

Shih-Tsung Hsiao

Huang-Wei Wu

Huang-Wen Chen

A process control method is provided for performing a deposition process on a plurality of wafers of a batch. The process control method includes: deciding a placement location of the wafers of the batch according to the history information of a tool and the product information of the batch; calculating a target value of each placement location according to the placement location of the wafers of the batch and the history information of the tool; calculating a process parameter according to the history information of the tool, the product information of the batch, and the target value of each placement location; and performing a deposition process according to the placement location of the wafers of the batch and the process parameter.

Growing community of inventors

Hsinchu County, Taiwan

Sheng-Hsiu Peng