Truesense Imaging, Inc.

Semiconductor Components Industries, LLC

Eastman-kodak Company

Omnivision Technologies, Inc.

Truesence Imaging, Inc.

Shen Wang

Eric J Meisenzahl

Edward T Nelson

Robert P Fabinski

David N Nichols

Eric Gordon Stevens

Gregory Oscar Moberg

Laurel J Pace

Greg L Archer

James E Doran

Christopher Parks

William F DesJardin

Robert Kaser

Xueyuan Liu

Thomas R Carducci

Greg Leland Archer

Edward Tichenor Nelson

Various embodiments of the present technology may comprise methods and apparatus for a CCD image sensor. The image sensor may comprise a center channel disposed along a horizontal center line of the pixel array for collecting and transferring charge. The center channel is electrically coupled to a lateral overflow drain. In various embodiments, the image sensor may comprise a light shield under a gap between neighboring microlenses, such as a gap along the center line, to block light, such as to maintain a uniform, spatial sampling pattern across the device. In various embodiments, the image sensor may comprise a barrier region disposed between the center channel and the lateral overflow drain, for example to prevent charge from the lateral overflow drain being injected back into the center channel and adjacent pixels.

Methods and apparatus for a CCD image sensor

An image capture device includes an image sensor, a reading component, a timing generator, and a voltage regulator. The image sensor includes a temperature sensor configured to measure temperature measurements of the image sensor. The reading component is configured to read the temperature measurements from the temperature sensor. The timing generator is configured to apply an electronic shutter pulse to the image sensor. The voltage regulator is coupled between the temperature sensor and the reading component for regulating increased voltage at the reading component resulting from the electronic shutter pulse.

Image sensor including temperature sensor and electronic shutter function

An image capture device includes an image sensor. The image sensor includes a temperature sensor for measuring temperature measurements of the image sensor. A timing generator is coupled to the image sensor for applying an electronic shutter pulse to the image sensor to drain away all charge in photodiodes of the image sensing region prior to image capture. A reading component is coupled to the temperature sensor for reading the temperature measurements from the temperature sensor. The image capture device is configured to prevent erroneous temperature readings by the reading component resulting from substrate punch-through from the application of the electronic shutter pulse.

An image sensor includes a substrate having a first conductivity type. A first well in the substrate has an opposite conductivity type and is doped with opposite conductivity type dopant. A second well in the first well has the opposite conductivity type and is doped with opposite conductivity type dopant. A first region in the second well has the opposite conductivity type and is doped with opposite conductivity type dopant. A second region in the first region has the first conductivity type and is doped with first conductivity type dopant. A third region in the second well adjacent the first region is of the opposite conductivity type and is doped with opposite conductivity type dopant. A temperature sensor is disposed between, and is connected to each of, the second region and the third region.

In various embodiments, image sensors incorporate multiple output structures by including multiple sub-arrays, at least one of which includes a region of active pixels, a dark pixel region that is fanned and/or slanted, a dark pixel region that is unfanned and unslanted, a horizontal CCD, and an output structure for conversion of charge to voltage.

Image sensors with multiple output structures

An integrated circuit includes a device identification circuit and a temperature sensor diode connected in parallel from a common node. The device identification circuit includes a resistor connected to a diode-connected transistor. The device identification circuit and the temperature sensor diode are adapted to not be simultaneously operating in an ON state. A first voltage is applied to the common node to place the device identification circuit in an ON state and place the temperature sensor diode in an OFF state to identify the integrated circuit. A second voltage is applied to the common node to place the device identification circuit in an OFF state and place the temperature sensor diode in an ON state to determine a temperature of the integrated circuit.

Device identification and temperature sensor circuit

Both a device-identification feature and a temperature-sensor feature are combined on a single integrated circuit. In various embodiments, both features are not operative simultaneously.

Combined device identification and temperature measurement

A method comprising an algorithm for automatically detecting an object in a digital image in order to determine if a scent can be associated with the detected object and applying the scent to the print medium, and a printer equipped to apply the scent.

Apparatus and method for printing in both image and aroma domains intelligently

A Charge-Coupled Device (CCD) image sensor includes a linear array of photodetectors. The photodetectors in the linear array are arranged into distinct sub-arrays with each sub-array including two or more photodetectors. An output channel is connected to each sub-array of photodetectors. Each output channel includes a horizontal CCD shift register and an output structure connected to an end of the horizontal CCD shift register in a linear arrangement with respect to each other. Each successive output channel is disposed on an alternate side of the linear array. Every other output channel is disposed on an alternate side of the linear array. One or more dark reference pixels can be connected to one or more additional shift register elements in the horizontal CCD shift registers.

Method for producing a linear image sensor having multiple outputs

A charge-coupled device (CCD) image sensor includes a layer of a semiconductor material having a first conductivity type. A horizontal CCD channel region of a second conductivity type is disposed in the layer of the semiconductor material. The horizontal CCD channel region includes multiple phases that are used to shift photo-generated charge through the horizontal CCD channel region. Distinct overflow drain regions are disposed in the layer of semiconducting material, with an overflow drain region electrically connected to only one particular phase of the horizontal CCD channel region. A buffer region of the second conductivity type can be used to electrically connect each overflow drain to the one particular phase of the horizontal CCD channel. Multiple barrier regions are disposed in the layer of semiconductor material, with each barrier region disposed between each overflow drain and the one particular phase electrically connected to the drain.

CCD image sensors having multiple lateral overflow drain regions for a horizontal shift register

Linear image sensor with multiple outputs

A pixel array in an image sensor includes multiple pixels. The pixel array includes vertical shift registers for shifting charge out of the pixel array. The vertical shift registers can be interspersed between the pixels, such as in an interline image sensor, or the photosensitive areas in the pixels can operate as vertical shift registers. The pixels are divided into blocks of pixels. One or more electrodes are disposed over each pixel. Conductive strips are disposed over the electrodes. Contacts are used to connect selected electrodes to respective conductive strips. The contacts in at least one block of pixels are positioned according to one contact pattern while the contacts in one or more other blocks are positioned according to a different contact pattern. The different contact patterns reduce or eliminate visible patterns in the contact locations.

CCD sensors with multiple contact patterns

A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die locations in the die identification region specifying a location of a respective die on the wafer.

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Webster, NY, United States of America

Shen Wang