Hewlett-packard Development Company, L.p.

Other

Hewlett-packard Company

Shen Buswell

Deanna J Bergstrom

Daniel Frech

Rio Rivas

Jeffrey R Pollard

Mehrgan Khavari

Conrad Jenssen

Paul Templin

Mark H MacKenzie

Naoto A Kawamura

Michael D Miller

Roberto A Pugliese

Ronald L Enck

Michael B Hager

Thomas E Pettit

Susanne L Kumpf

Nichole Godwin

Mahrgan Khavarl

Mark H MacKenzle

A method of fabricating a fluid feed slot in a print head substrate includes making a cut into a first surface of a substrate using a cutting disk having a generally planar surface oriented generally perpendicular to the first surface, and removing material from a second surface of the substrate. Making the cut and removing the material form, in combination, the fluid feed slot in the substrate at least a portion of which passes entirely through the substrate, with a full length of the fluid feed slot extending less than a full length of the substrate, and making the cut into the first surface includes providing a first completed portion of the fluid feed slot with curved surfaces at opposite end walls thereof converging from the first surface toward the second surface.

Methods and systems for forming slots in a semiconductor substrate

The described embodiments relate to methods and systems of forming slots in a substrate. One exemplary embodiment forms a feature into a substrate having a first substrate surface and a second substrate surface, and moves a sand drill nozzle along the substrate to remove substrate material sufficient to form, in combination with said forming, a slot through the substrate.

Method making ink feed slot through substrate

The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.

Slotted substrate and method of making

A method for forming an opening through a substrate includes removing a first portion of a first face of a substrate to form a first recessed surface oblique to the first face and removing a second portion of the substrate to form a passage extending through the substrate such that the passage is bordered by the first surface.

Substrate passage formation

Method making a cutting disk into of a substrate

Methods and systems for forming slots in a substrate that has opposing first and second surfaces. The method makes a laser cut through either the first or second surface of the substrate sufficient to form a first trench. Material is also removed through the other of the first and second surfaces effective to form, in combination with the laser cut, a slot. At least a portion of the slot passes entirely through the substrate, and the slot has an aspect ratio greater than or equal to 1.

Slotted substrates and methods and systems for forming same

The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.

Methods and systems for forming slots in a substrate

The exemplary embodiments describe a semiconductor substrate having microelectronics integrated thereon. In one exemplary embodiment, the semiconductor substrate comprises a plurality of fluid ejecting elements positioned over a substrate. The semiconductor substrate can further comprise one or more fluid feed channel(s) formed in the substrate. The one or more fluid feed channel(s) being configured to deliver fluid to the plurality of fluid ejecting elements. The one or more fluid feed channel(s) are defined at least in part by first and second substantially parallel side walls and first and second non-parallel end walls.

Slotted semiconductor substrate having microelectronics integrated thereon

The described embodiments relate to a slotted substrate for use in a fluid ejecting ice. One exemplary embodiment includes a substrate having a thickness between generally opposing first and second surfaces. A slot received in the substrate. The slot has a central region joined with at least one terminal region. The central region extends between the first and second surfaces. The at least one terminal region includes, at least in part, a bowl-shaped portion that has a diameter at the first surface greater than a width of the central region at the first surface.

A technique for controlling the abrasive jet machining process to drill an ink feed slot through an ink jet printhead substrate. The approach results in a relatively even slot edge adjacent to channels that supply the ink-droplet firing chambers of the printhead. The evenness of the edge reduces the tolerances required for designing the channels and other printhead components, thus permitting the construction of printheads with increased droplet ejection frequency. The printhead size is correspondingly reduced.

Growing community of inventors

Monmouth, OR, United States of America

Shen Buswell