Gte Laboratories Incorporated

Ceramics Process Systems Corporation

Sheldon I Lieberman

Eric A Barringer

James D Hodge

Mark S Schmidt

Sophia R Su

Jeffrey T Neil

Elizabeth A Trickett

Brian C Foster

Gautam Bandyopadhyay

Kenneth W French

Donald J Kelley

Richard Waack

William C Gruber

Michael Hackney

Brian W Saxton

A method for making essentially crack free large cross section ceramic articles by injection molding techniques comprises the use of from about 0.1 v/o to about 10 v/o fibers with the ceramic injection molding formulation followed by the injection molding, binder removal and densification steps to form an essentially crack free densified large cross section ceramic article. The fibers are softened prior to the onset of densification and incorporated into the ceramic intergranular phase. This process eliminates the component distortion during densification which would have occurred if the fibers remained in the component.

Method of making large cross section injection molded or slip cast

A method of producing crack free ceramic parts having large cross-sections is disclosed. An initial mixture of ceramic powder containing a binder and from 0.1 v/o to 10 v/o of whiskers or fibers which are made of carbon, graphite or high temperature melting or decomposition point organic polymers. The mixture is either injection molded or slip cast to form a shaped article. The shaped article is heated in a nitrogen atmosphere to a temperature of 450.degree. C. and then in an atmosphere of air at a temperature of 450.degree. C. to 600.degree. C. to completely remove the binder. The resulting binderless shaped article is then heated at 800.degree. C. for a period of time sufficient to completely remove the whiskers or fibers from the shaped articles. The article is then encapsulated in glass and hot isostatically pressed at a pressure of 30,000 psi to densify the article to approximately 99% of theoretical. The resulting article has a complex geometry and a large cross-section but without detrimental cracks.

Bonding additives for refractory metallization compositions allow for circuit traces having good resistivities and adhesion values in excess of 6 kpsi, generally between about 10 and 20 kpsi. The inks are provided in formulations devoid of a glass component, and are suitable for co-sintering circuit traces and vias with 96% alumina substrates, and especially for 99% alumina substrates. Suitable bonding additives are the oxides of molybdenum, tungsten, niobium, manganese, yttrium, and titanium, or mixtures of such oxides.

Bonding additives for refractory metallization inks

Glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns are obtained by co-sintering a glass-ceramic composite and copper, silver, palladium, gold, based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems include composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process. The package is fabricated using a tape specifically designed for clean binder burnout in a reducing atmosphere at low temperatures and also for superior mechanical and thermal properties. Metallization, applied by the thick film screening technique, utilized herein has glass-ceramic bonding agents designed to promote adhesion yet maintain the desired electrical properties and post-processing characteristics.

Co-fired metal-ceramic package

A process for making a homogeneous yttria-alumina doped silicon nitride article is described. A uniform coating of yttria and alumina is applied to the surface of silicon nitride particles by a chemical application of the hydroxides of yttrium and aluminum followed by drying and a subsequent conversion of the hydroxides to the corresponding oxides. The resulting powder is formed into an article and pressureless sintered to a density greater than 99% of theoretical.

Process for making a homogeneous doped silicon nitride article

This invention relates to glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns obtained by co-sintering a glass-ceramic composite and copper, silver, palladium or gold based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems disclosed herein contains composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process.

Method for producing materials for co-sintering

Thionyl chloride electrolyte having less than about 1 ppm water contamination is prepared by mixing dry thionyl chloride solvent with sulfuryl chloride electrolyte having less than about 1 ppm water contamination and then removing the sulfuryl chloride.

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Burlington, MA, United States of America

Sheldon I Lieberman