Ciba-geigy Corporation

Ciga-geigy Corporation

Ciba-geigy Corproation

Sheik A Zahir

Bernd Tieke

Sameer H Eldin

Charles E Monnier

Alfred Renner

Jurgen Finter

Ewald Forster

Hermann Diethelm

Wolfgang Scharf

Karl Mechera

Cecile Pasquier

Hans Kramer

Maurice Dupre

Mixtures essentially comprising compounds of formula I or II ##STR1## wherein X is a hydrogen atom or vinyl, A is a divalent aromatic radical which is unsubstituted or substituted by one or more C.sub.1 -C.sub.20 alkyl groups, halogen atoms or halogen-substituted C.sub.1 -C.sub.20 alkyl groups, R.sub.1, R.sub.1 ', R.sub.2, R.sub.2 ', R.sub.3 and R.sub.3 ' are each a hydrogen atom, or R.sub.1 and R.sub.1 ', R.sub.2 and R.sub.2 ' and R.sub.3 and R.sub.3 ' are each together ethylene, R.sub.4 is C.sub.1 -C.sub.6 alkyl, phenylalkyl containing 1 to 6 carbon atoms in the alkyl moiety or is trialkylsilyl containing 1 to 6 carbon atoms in each alkyl moiety, m is 0, 1 or 2, n is 0 or an average number from 1 to 200, p is an average number from 1 to 100 and q is 0 or an average number from 1 to 100, can be cured by heating and are suitable for making laminates, especially for fabricating copper-clad circuit boards.

Mixtures of spiroheptadienes

The invention relates to compositions containing

Polymer compositions containing a dissolved dibenzalacetone palladium

Epoxysiloxanes having, per molecule, at least two groupings of the formula ##STR1## in which R.sup.1 and R.sup.2 independently of one another are C.sub.1 -C.sub.10 alkyl, C.sub.1 -C.sub.10 alkyoxy, C.sub.3 -C.sub.8 cycloalkyl, C.sub.6 -C.sub.10 aryl, benzyl or a halogen atom and in which each grouping of the formula I in each case is attached directly to a silicon atom of the siloxane radical, are suitable for use as epoxy resins. They can be used together with customary epoxy resin curing agents, for example, for the production of adhesives, sealing materials, lacquers or encapsulating resins, and afford products having excellent properties. The epoxysiloxanes according to the invention are also valuable reactive thinners and flexibilizers for curable epoxy resin mixtures.

Epoxysiloxanes

Dehydrogenated poly(spiro[2,4]hepta-4,6-diene) which is insoluble in organic solvents, has an electrical conductivity of at least 10.sup.-10 S.times.cm.sup.-1, and contains, relative to the total number of recurring structural units in the polymer, 0-90 mol % of the recurring structural units of the formulae I and II ##STR1## in which R.sup.1 is in each case a hydrogen atom or an alkyl group having 1 to 4 C atoms, and 10-100 mol % of at least one of the recurring structural units of the formulae III to VI ##STR2## in which R.sup.1 is as defined in formula I or II and X.sup.- is a bromide or iodide ion or an anion of a Lewis or protonic acid, is obtained by treating poly(spiro[2,4]-hepta-4,6-diene) with bromine, iodine or a Lewis or proton-donating acid, and can be used in an electrically conducting material for the production of, for example, conductors, electrodes, batteries or semiconductor components.

Dehydrogenated polyspiroheptadiene

The invention relates to compositions of a soluble polyimide and polypyrrole. These compositions can preferably be prepared by anodic oxidation of pyrrole or a pyrrole derivative at electrodes coated with polyimide. They make it possible to prepare free standing electrically conductive films.

Polypyrrole/polyimide compositions

Compounds of formula I ##STR1## wherein R.sub.1 is hydroxyl or glycidyloxy, R.sub.2 is hydrogen, alkyl, alkoxy, halogen, aryl, aralkyl or alkaryl, R.sub.3 is hydrogen or alkyl or both R.sub.3 s together are alkylene, and q is 1 to 3.5, together with epoxy resins and thermoactivatable hardeners and/or curing catalysts, are suitable for the preparation of curable mixtures. The cured products obtained therefrom can be employed for the preparation of electrically conductive coatings or patterns by tempering at elevated temperature or by irradiation with actinic light. Metal can be deposited without current on said electrically conductive coatings or patterns.

Curable mixtures containing copolymerizable dibenzalacetone palladium

2,6-Disubstituted 4-epoxypropyl glycidyl ethers of the formula ##STR1## wherein X is a group R' or X is a group of the formula ##STR2## and each of R and R' independently of the other is C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, a halogen atom or C.sub.6 -C.sub.10 aryl, can be used, together with customary epoxy resin hardeners, for the preparation of cured products, in particular for application in the electronics industry, or as adhesives. Compounds of the formula are also valuable reactive diluents for curable epoxy resin mixtures.

2,6-disubstituted 4-epoxypropylphenyl glycidyl ethers and the use thereof

Compounds of formula I or II ##STR1## in which formulae R.sup.1 and R.sup.2 are each independently of the other hydrogen, alkyl, alkenylmethyl, cyclohexyl, phenyl, benzyl or tolyl, or are a --CH.sub.2 CHR.sup.3 --CH.sub.2 --S--H group, R.sup.3 and R.sup.4 are each independently of the other hydrogen or methyl, X is alkylene, --S--, --SO--, --SO.sub.2 -- or substituted alkylene, R.sup.5 and R.sup.6 are each independently of the other hydrogen or alkyl, R.sup.8 is hydrogen, alkyl, alkenylmethyl or phenyl, and wherein n is an integer from 1 to 10, can be used as hardeners for epoxy resins. The compositions containing epoxy resins and these hardeners are particularly suitable for use as adhesive formulations. The cured products have good moisture resistance.

Mercaptan-containing polyphenols

The invention relates to polyepoxides which are obtainable by reacting compounds of formula I ##STR1## wherein n is 1 or 2, and X, if n is 1, is a group R.sub.3, or, if n is 2, X is a group of the formula ##STR2## each of R.sub.1 and R.sub.3 independently of the other is C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, allyl, a halogen atom or C.sub.6 -C.sub.10 aryl and R.sub.2 is allyl, 1-propenyl or 2-propenyl, with compounds containing phenolic OH groups, and subsequently epoxidizing the resultant adducts in the presence of a peracid. Said polyepoxides can be used, together with customary epoxy resin hardeners, for the preparation of cured products, in particular for coating electronic components, or as adhesives.

Polyepoxides and the use thereof

A mixture consisting of a polymaleimide and a copolymerizable monomer or a prepolymer formed from these two compounds contains, as the polymerization catalyst, an ethane which is substituted by aromatic groups and hydroxyl groups or halogen (cf. formula II), such as benzpinacol. The mixture is stable on storage and heat-curable. It can be cured, while at the same time being shaped to give mouldings, sheet-like structures, laminates, adhesive bonds or foams, for example by casting or compression moulding.

Heat-curable mixtures, stable on storage, based on polyimides and

This invention pertains to an acrylate or methacyrate of monohydric or dihydric, mononuclear or binuclear phenols which are substituted by allyl, methallyl or 1-propenyl groups, or hydroxyalkyl ethers thereof. The acrylates or methacrylates of the invention can be used in compositions useful in a casting or impregnating resin, adhesive, lacquer and binder which can be cured by irradiation and/or heat.

Alkenylphenyl substituted acrylates or methacrylates

Inorganic-organic foams are obtained by foaming a mixture of

Foams of silicates and poly(meth)acrylic acids

Mono- and polyvalent phenolglycidyl ethers which contain in the molecule at least one 1-propenyl group in the ortho- or para-position with respect to the glycidyl ether group, or isomeric mixtures of mono- or polyvalent phenolglycidyl ethers which are propenyl-substituted in the ortho or para-position with respect to the glycidyl ether group and mono- or polyvalent phenolglycidyl ethers which are allyl-substituted in the ortho- or para-position with respect to the glycidyl ether group, the proportion of propenyl groups in the isomeric mixture having to be at least 5 equivalent-%, relative to the sum of the equivalents of propenyl and allyl groups, are obtained by a process wherein the propenyl-substituted phenols, or isomeric mixtures of propenyl- and allyl-substituted phenols, are glycidylated with an epihalohydrin. The novel compounds can be converted, both by use of curing agents for epoxide resins and by radical polymerization, into polymers having valuable mechanical properties.

Propenyl-substituted phenolglycidyl ethers, processes for producing

Mixtures which can be cured to give moulded materials having technically very valuable mechanical and dielectric properties, characterized in that they contain

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Oberwil, Switzerland

Sheik A Zahir