Apple Inc.

Other

Shayan Malek

Michael Benjamin Wittenberg

Daniel William Jarvis

Jared Mitchell Kole

Gregory N Stephens

Benjamin J Pope

Sawyer Isaac Cohen

Scott A Myers

Richard Hung Minh Dinh

David A Pakula

Miguel C Christophy

Richard P Howarth

Shota Aoyagi

Ashutosh Yugesh Shukla

Jason S Sloey

John B Ardisana, Ii

Warren Jones

Tang Yew Tan

Ian A Spraggs

Dhaval N Shah

Richard Hung Dinh

James B Smith

Jonathan C Denby

Matthew D Hill

Nicholas George Merz

Rasamy Phouthavong

Robert Steinfeld

Kurtis J Mundell

Sina Bigdeli

Ramachandran Chundru

Jonathan P Ive

Duncan Robert Kerr

Bartley K Andre

Eugene Antony Whang

Peter N Russell-Clarke

Christopher J Stringer

Martha Evans Hankey

Rico L Zorkendorfer

Daniele De Iuliis

Daniel J Coster

Jody R Akana

Matthew Dean Rohrbach

Jeremy D Bataillou

Julian Hoenig

Mikael M Silvanto

Eric Steven Jol

Benjamin M Rappoport

Sean S Corbin

Lucy Elizabeth Browning

Derek William Wright

Lee E Hooton

Marwan Rammah

Justin Richard Wodrich

Benjamin Shane Bustle

Kelvin Kwong

Tyler B Cater

Bryan Patrick Kiple

Douglas G Fournier

Nicholas G L Merz

Eric N Nyland

Boon Wai Shiu

Santhana Krishnan Balaji

Eric W Bates

Vivek Katiyar

Timothy S Lui

Devon A Monaco

Steve McClure

Bryan D Keen

Sherry Lee

Alex C Yeung

Dale T Morgan

John Ardisana

Andriy Pletenetskyy

Aaron H Squier

Dan Jarvis

Astoush Y Shukla

Nicholas Ian Lubinski

Nikko Lubinski

Battery for an electronic device

An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.

Circuit board interposer

A mobile phone may include a housing defining at least a portion of a back exterior surface of the mobile phone, a display stack at least partially within the housing, the display stack defining an active region configured to produce a graphical output, and a transparent cover positioned over the display stack. The transparent cover may define a first portion covering the active region of the display stack, a second portion adjacent the first portion, and a hole in the second portion and extending through the transparent cover. The mobile phone may also include a button element positioned in the hole of the transparent cover, a force-sensing system configured to detect an input applied to the button element, a circuit board coupled to the force-sensing system, and a shim positioned below the first portion of the transparent cover and having same thickness that as the circuit board.

Handheld electronic device

Display for an electronic communication device

This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.

Internal component arrangement within a housing

Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.

Component shielding structures with magnetic shielding

An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff. The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.

Component protection structures for electronic devices

Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.

Electromagnetic interference shielding and strain relief structures for coupled printed circuits

Several embodiments for ejecting a SIM tray from an electronic device are disclosed. In some embodiments, a lever positioned behind the tray can be actuated to eject the tray. In some embodiments, a pivot mechanism can be actuated to eject the tray. In other embodiments, a gear mechanism can be actuated to eject the tray. In other embodiments, a spring element can be actuated to eject the tray. In some embodiments, the electronic device may include a key feature that allows the tray to eject only when a tool is used having a mating key feature with the key feature of the electronic device.

Subscriber identity module (SIM) ejector

Component for electronic device

This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.

An electronic device may have a printed circuit to which electrical components are mounted. Electromagnetic shields may be mounted to the printed circuit over the components to suppress interference. A shield may have a metal frame covered with a conductive fabric. The conductive fabric may cover an opening in the top of the frame. An insulating layer may be formed on the lower surface of the conductive fabric to prevent shorts between components on the printed circuit and the conductive fabric. An insulating cap such as an elastomeric polymer cap may also be formed over each component to provide electrical isolation between the components and the conductive fabric. Shields may be formed by coupling shield cans to subscriber identity module shields or other metal structures in a device. Intervening wall structures may be removed to help provide additional shielding volume.

Electromagnetic shielding structures

A method and system for securing a flexible circuit to a mounting structure is disclosed. The system can include a surface-mount device, flexible circuit, stiffener, and bracket. The stiffener is used as an intermediate coupling device between the flexible circuit and bracket. The flexible circuit is coupled to the stiffener with a heat-activated adhesive. Next, the surface-mount device is mounted to the flexible circuit with surface-mounting techniques. A peripheral area of the stiffener is then welded to the bracket. The bracket in turn can be fastened to the enclosure of an electronic device.

Method and system for attaching flexible circuits to a mounting surface

Growing community of inventors

San Jose, CA, United States of America

Shayan Malek