Applied Materials, Inc.

Shawyon Jafari

Lin Zhang

Xuesong Lu

Andrew V Le

Jang Seok Oh

Chidambara A Ramalingam

Ralph Peter Antonio

Patrick L Smith

Fa Ji

Sanjeev Baluja

Ganesh Balasubramanian

Jian Li

Amit Kumar Bansal

David Walter Groechel

Paul Brillhart

Kalyanjit Ghosh

Sidharth Bhatia

Tejas Ulavi

Zhijun Jiang

Mayur G Kulkarni

Shailendra Srivastava

Kaushik Comandoor Alayavalli

Sumit Agarwal

Ilker Durukan

Li Wu

Yuxing Zhang

Heng-Cheng Pai

Yusheng Zhou

Pramod Nambiar

Priyanka Dash

Katherine Woo

Daniel Hwung

Dorothea Buechel-Rimmel

Kirubanandan Naina Shanmugam

Qiang Ma

Garrett Ho-Yee Sin

Katty Marie Lydia Gamon Guyomard

Katty Guyomard

Palash Joshi

Moin Ahmed Khan

Avishek Ghosh

Subhaschandra Shreepad Salkod

Methods of manufacturing a semiconductor processing chamber showerheads may include forming a melted aluminum alloy composition, cooling the melted aluminum alloy composition at a rate of at least 103 K/sec to form solid aluminum alloy particles, and forming a core region of a showerhead from the solid aluminum alloy particles. The core region of the showerhead may include an inner core region and an outer core region that may be coupled together. The inner core region may define a plurality of apertures. The outer core region may define a channel that receives a heating element. The methods may include coating the core region with one of aluminum or aluminum oxide and joining a peripheral edge of the outer core region with an inner edge of a metallic annular liner. The metallic annular liner may have a lower thermal conductivity than the core region of the showerhead.

Fabrication of a high temperature showerhead

A method includes receiving part data associated with a corresponding part of substrate processing equipment, sensor data associated with one or more corresponding substrate processing operations performed by the substrate processing equipment to produce one or more corresponding substrates, and metrology data associated with the one or more corresponding substrates produced by the one or more corresponding substrate processing operations performed by the substrate processing equipment that includes the corresponding part. The method further includes generating sets of aggregated part-sensor-metrology data including a corresponding set of part data, a corresponding set of sensor data, and a corresponding set of metrology data. The method further includes causing analysis of the sets of aggregated part-sensor-metrology data to generate one or more outputs to perform a corrective action associated with the corresponding part of the substrate processing equipment.

Part, sensor, and metrology data integration

Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.

Semiconductor chamber component cleaning systems

An FI having an in-situ particle detector and a method for particle detection therein are provided. In one aspect, the FI includes a fan, a substrate support, a particle detector, and an exhaust outlet. The fan, substrate support, and particle detector are arranged such that, in operation, the fan directs air towards the exhaust outlet and over a substrate on the substrate support to create laminar flow. The particle detector, positioned downstream from the substrate support and upstream from the exhaust outlet, analyzes the air and detects particle concentration before the particles are exhausted. The collected particle detection data may be combined with data from other sensors in the FI and used to identify the source of particle contamination. The particle detector may also be incorporated into other system components, including but not limited to, a load-lock or buffer chamber to detect particle concentration therein.

Advanced in-situ particle detection system for semiconductor substrate processing systems

Systems and methods for depositing a film in a PECVD chamber while reducing residue buildup in the chamber. In some embodiments disclosed herein, a processing chamber includes a chamber body, a substrate support, a showerhead, and one or more heaters configured to heat the showerhead. In some embodiments, the processing chamber includes a controller.

System and method for substrate processing chambers

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Sunnyvale, CA, United States of America

Shawyon Jafari