Arizona State University

Asm IP Holding B.v.

Shawn Whaley

Michael Schmotzer

Nicole Herbots

Robert Culbertson

Ross Bennett-Kennett

Ashlee Murphy

Brance Hudzietz

Matthew Bade

Sam Farmer

A reaction system for processing semiconductor substrates is disclosed. The reaction system includes a susceptor for holding the substrate as well as a baseplate as a part of housing for the reaction system. A pin located on the susceptor can interact with a baseplate feature located on the baseplate to result in a variable gap between the susceptor and the baseplate. The baseplate feature may take the form of a series of steps, a wedge, or a milled-out feature.

Variable gap hard stop design

Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly in the presence of an steam atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.

Methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization

Growing community of inventors

Chandler, AZ, United States of America

Shawn Whaley