W. L. Gore & Associates, Inc.

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Shawn Patrick Riley

Joseph K So

Andrew Wank

Donna Marie Alden

Mark Gazze

Robert Gargione

David Drop

Mai Tieu Banh

Wai Poon

Thomas P Kelmartin

Kenneth Stephen Zukor

Allen B Maples

Holly Blake

Ryder William Pingry

Bernd Zischka

Seth Harper

Colin F Cameron, Jr

Stephen Robb

Matthew Robert Gessner

Mark Duane Briggs

Werner Stübiger

Wai Sing Poon

Disclosed are protective hoods including particle barrier layers to reduce or prevent penetration of the hoods by particulates in the environment of a wearer. The particle barrier layer of a hood is accessible when the hood is intact. A hood described herein optionally includes an aperture for accessing the particle barrier layer. A hood described herein optionally includes a face opening that engages with a face mask to form a protective seal. A hood described herein optionally includes a visual indicator to indicate when the hood is properly positioned with respect to a face mask.

Hood including particle barrier

A V-panel filter apparatus and method of construction are provided. The method includes flowing curable potting material into a recess portion of an end cap, positioning first end edge surfaces of first and second filter panels into the contained potting material, and curing the potting material with the first and second filter panels positioned to diverge away from the end cap to define a V-shaped configuration. The method may include flowing curable potting material into a recess portion of a first side plate, positioning edge surfaces of the first and second filter panels into the contained potting material, and curing the potting material. Such steps may be repeated in relation to a second side plate and a header member. By utilizing a pot-and-place sealing methodology, improved seal interfaces are realized. Stability and construction advantages may be provided by snap-fit features of the header member and first and second side plates.

V-panel filters

The invention provides a plurality of polymeric particles embedded with silicate that include gas-filled polymeric microelements. The gas-filled polymeric microelements have a shell and a density of 5 g/liter to 200 g/liter. The shell having an outer surface and a diameter of 5 &#x3bc;m to 200 &#x3bc;m with silicate particles embedded in the polymer. The silicate particles have an average particle size of 0.01 to 3 &#x3bc;m. The silicate-containing regions are spaced to coat less than 50 percent of the outer surface of the polymeric microelements; and less than 0.1 weight percent total of the polymeric microelements is associated with i) silicate particles having a particle size of greater than 5 &#x3bc;m; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric micro elements agglomerated with silicate particles to an average cluster size of greater than 120 &#x3bc;m.

Hollow polymeric-silicate composite

The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0.1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 &#x3bc;m; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 &#x3bc;m.

Silicate composite polishing pad

The method provides a method of preparing a silicate-containing polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. The method includes introducing a feed stream of gas-filled polymeric microelements into a gas jet. The polymeric microelements have varied densities, varied wall thickness and varied particle size. Passing the gas-filled microelements in the gas jet adjacent a Coanda block, the Coanda block having a curved wall for separates the polymeric microelements with Coanda effect, inertia and gas flow resistance. The coarse polymeric microelements from the curved wall of the Coanda block to clean the polymeric microelements. The polymeric microelements collected contain less than 0.1 weight percent total of the polymeric microelements being associated with i) silicate particles having a particle size of greater than 5 &#x3bc;m; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 &#x3bc;m. Inserting the cleaned polymeric microelements into a polymeric matrix forms the polishing pad.

Method of forming silicate polishing pad

Growing community of inventors

Wilmington, DE, United States of America

Shawn Patrick Riley