Motorola Corporation

Arizona State University

Arizona Board of Regents, a Body Corporate

Az Board of Regents, a Body Corporate of the State of Az Acting for and on Behalf of Az State University

Shawn O'Rourke

Matthew Stainer

Douglas E Loy

Scott Ageno

Ravichandran Subrahmanyan

Jesmin Haq

Nick R Munizza

Robert Naujokaitis

Curtis D Moyer

Albert Alec Talin

Marc Kenneth Chason

Kenneth Andrew Dean

Bernard F Coll

Ke Keryn Lian

Hanqing Jiang

Robert H Terbrueggen

Manes Eliacin

Michael Marrs

Peter A Smith

Daniel J Sadler

Claudia Gamboa

Barry O'Brien

Susumu Sakamoto

Kazuo Kato

Dirk Bottesch

Pete Smith

Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.

Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom

Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180&#xb0; C.; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.

Method of providing a flexible semiconductor device at high temperatures and flexible semiconductor device thereof

Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing

Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.

A flexible, transparent electrode structure and a method of fabrication thereof are provided comprising a transparent electrode which may maintain electrical connectivity across a surface of a flexible substrate so that the substrate may flex without affecting the integrity of an electrical contact. The transparent electrode includes conductive nanowires that are coupled to the substrate through a conducting oxide layer. The conducting oxide layer effectively provides a template onto which the nanowires are deposited and serves to anchor the nanowires to the substrate surface.

Flexible transparent electrodes via nanowires and sacrificial conductive layer

A method of fabricating a field emission device cathode using electrophoretic deposition of carbon nanotubes in which a separate step of depositing a binder material onto a substrate, is performed prior to carbon nanotube particle deposition. First, a binder layer is deposited on a substrate from a solution containing a binder material. The substrate having the binder material deposited thereon is then transferred into a carbon nanotube suspension bath allowing for coating of the carbon nanotube particles onto the substrate. Thermal processing of the coating transforms the binder layer properties which provides for the adhesion of the carbon nanotube particles to the binder material.

FED cathode structure using electrophoretic deposition and method of fabrication

Circuit boards ( ) and methods for fabricating circuit boards that include heaters for maintaining temperature sensitive components at an operating temperature are provided. Resistive traces ( ) are included in the circuit boards proximate temperature sensitive apparatus ( ). Thermally conductive patches ( ) are interposed between the resistive traces and the temperature sensitive components. The thermally conductive patches establish zones of relatively uniform temperatures. According to a preferred embodiment of the invention the temperature sensitive apparatus comprises a fluid conduit ( ).

Heater for temperature control integrated in circuit board and method of manufacture

A field emission display ( ) having an anode plate ( ) that has phosphor channels ( ). The phosphor channels ( ) are formed by depositing a first layer of photosensitive film ( ) on a substrate ( ). Stripes are patterned into the first layer photosensitive film ( ) using ultraviolet light. A second layer of photosensitive film ( ) is formed on the first layer of photosensitive film ( ). Stripes are patterned into the second layer of photosensitive film ( ) using ultraviolet light. The stripes in the second layer of photosensitive film ( ) are substantially perpendicular to the first layer of photosensitive film ( ). Both layers of photosensitive film are developed to form channel structures. Phosphor is formed in the channel structures to form the phosphor channels ( ). The anode plate ( ) is coupled to a cathode plate ( ) to form the field emission display ( ).

Field emission display and method of manufacture

A method for fabricating viewing screen ( ) includes the steps of: adding to a black surround paste a ductile metal paste, adding to the black surround paste lead titanate particles, depositing the black surround paste on glass substrate ( ), and heating the black surround paste and glass substrate ( ) to affix the black surround paste to glass substrate ( ), thereby forming black matrix ( ). The ductile metal paste and lead titanate particles are added in amounts sufficient to realize an extent of cracking in black matrix ( ) upon repeated heating to a temperature within a range of 450-600&deg; C. that is significantly less than that exhibited by an unimproved black matrix, which is made only from the material of the black surround paste.

Viewing screen for a display device and method for the fabrication thereof

A vacuum microelectronic device ( ) is formed by applying a first conductor ( ) to a substrate ( ) and utilizing the first conductor ( ) to expose a dielectric material ( ) and a second conductive material ( ) from a back surface of the substrate ( ). A second conductor ( ) and a dielectric ( ) are formed from the second conductive material ( ) and the dielectric material ( ), respectively. This method self-aligns the dielectric ( ) and the second conductor ( ) with the first conductor ( ). Electron emitters ( ) of the vacuum microelectronic device ( ) are formed on the first conductor ( ).

Method of forming a vacuum micro-electronic device

Viewing screen for a display device

Phosphor and method for the fabrication thereof

Growing community of inventors

Tempe, AZ, United States of America

Shawn O'Rourke