Intel Corporation

Other

Intel Corproation

Shawn McEuen

Songnan Yang

Ulun Karacaoglu

Anand S Konanur

Gary L Bookhardt

Mark Angus MacDonald

Russell S Aoki

Mark E Sprenger

David Pidwerbecki

Ihab A Ali

Paul J Gwin

Ralph V Miele

Min Suet Lim

Yew San Lim

Sridhar V Machiroutu

Ben Dekock

Evan Piotr Kuklinski

Neil C Delaplane

Joseph A Cervantes

Josh Gordon

Robert W Wolcott

Marc A Abrams

Sami Markus Heinisuo

Wally Byers

Joshua T Linden-Levy

Robert L Van Egmond

Brad T Combs

Ryan Wilday

Kari Pekka Johannes Mansukoski

Bruce Cheng

Jeffrey Ho

Hinges for electronic devices are disclosed herein. An example hinge includes a bracket capable of being coupled to a first portion of the electrical device. The bracket has a barrel defining a first opening. The hinge also includes a shaft in the first opening. The shaft is rotatable in the first opening. The hinge further includes a sleeve capable of being inserted into a bore in a second portion of the electronic device. The sleeve defines a second opening to receive a portion of the shaft.

Hinges for electronic devices

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate that includes traces, a radiation source on the substrate, and a trace routable radiation shield on the substrate. At least a portion of the traces extend through the trace routable radiation shield and the trace routable radiation shield can help shield radiation sensitive components from at least a portion of the radiation from the radiation source.

Trace routable radiation shield

In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a housing, a first shaft rotatable about a first axis, a second shaft rotatable about a second axis, a belt drive assembly to couple the first shaft to the second shaft, and a tension assembly to apply a tension to the belt drive assembly. Other examples may be described.

Belt driven hinge assembly for electronic devices

Embodiments of systems and methods for providing in-mold laminate antennas are generally described herein. Other embodiments may be described and claimed.

Mobile device housing including at least one antenna

In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a shaft rotatable about a first axis, a brake selectively engageable with a portion of the shaft, and an electroactive polymer (EAP) actuator coupled to the brake, wherein the EAP actuator selectively engages the brake with a portion of the shaft in response to a signal from the controller. Other examples may be described.

Smart variable torque display

A support that is selectively adjustable to a plurality of configurations that enable a variety of viewing/user orientations of a mobile device. The mobile device includes a display, a back panel, a support positioned at the back panel, and adjustment members pivotally connected to respective outer ends of the support and mounted at the back panel to facilitate linear, reciprocating movement along an axis so as to change the relative orientation of the support relative to the back panel.

Adjustable support and a mobile computing device having an adjustable support

Mobile device cover including at least one antenna

Method and apparatus for in-mold laminate antennas

Carrier racks including an elongate base member, a pivot mechanism mounted to the base member and configured to rotate relative to the base member, and a frame coupled to the pivot mechanism for supporting cargo, wherein the pivot mechanism is configured to pivot the frame between a loading position and a stowed position for transport, a first support member of the frame being oriented substantially horizontal in the stowed position.

Carrier racks for vehicles

Techniques for precision testing of thermal interface materials are described. An apparatus may include multiple anvils each having multiple sensors disposed along its axis. A thermal interface material may be disposed between the anvils. A control module may be communicatively coupled to said sensors and arranged to receive temperature readings from the multiple sensors to form a temperature gradient, determine a surface temperature for each anvil based on the temperature gradient, determine a heat flux through the thermal interface material based on the surface temperature, and determine a resistance value for the thermal interface material based on the heat flux. Other embodiments are described and claimed.

Techniques for precision testing of thermal interface materials

Network communication housing

A heat sink may be spring strapped onto a socketed processor using clips that engage the spring strap and that are pre-positioned on the circuit board. The clips may be C-shaped and may include an upper spring arm portion, a vertical portion, and a base which may be surface mounted to the circuit board. The upper spring arm of the C-shaped clip then releasably engages the spring strap to clamp the heat sink firmly onto the socketed processor.

Clamping heat sinks to circuit boards over processors

A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generate varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, a top cover and bottom cover of the packaging cover are assembled with a separate frame to secure a coupling between the top and bottom covers of the packaging cover. In one embodiment, the frame includes grooves to receive notches of a module connector coupled to a motherboard. In one embodiment, the frame includes an aperture for receiving connections to thermal solutions external to the packaging cover.

Protective cover and packaging for multi-chip memory modules

Growing community of inventors

Portland, OR, United States of America

Shawn McEuen