Seagate Technology Incorporated

Shawn Jacob Noland

Anthony John Pronozuk

William Leon Rugg

James Edward Dykes

Lon Matthew Stevens

Andrew James Dunn

Chau Chin Low

Daniel Milligan

The disclosed technology includes an open frame storage device assembly for computing equipment. The assembly is configured to vertically suspend carriers, which hold storage devices, from a rack and to interconnect the storage devices to a computer system. The disclosed assembly provides high storage capacity, low weight, efficient cooling, and centralized power.

Storage device assembly

An apparatus as associated method contemplating a housing and a midplane supported by the housing having a midplane connector. A printed circuit board (PCB) having a PCB connector is selectively connectable to the midplane connector. A plurality of data storage devices are arranged on the printed circuit board in a staggered pattern, each electrically connected to the PCB connector via a respective electrical trace in the PCB.

Multiple drive sled in a storage array

Apparatus for retracting and extending sets of operational processing devices in a multi-device enclosure. In accordance with some embodiments, an enclosed housing is provided with opposing first and second ends. Sleds are individually movable between a retracted position within the enclosed housing and an extended position in which the sled projects from the first end. Each sled supports a group of processing devices. A control board is disposed within the enclosed housing adjacent the second end. A plurality of flex circuits contactingly engage the processing devices to provide communication paths between the processing devices and the control board in both the retracted and extended positions of the sleds.

Multi-device storage enclosure with extendable device support sleds

An airfoil to provide directed cooling of active elements, such as in a multi-device storage enclosure. In accordance with some embodiments, an apparatus includes a housing having opposing first and second ends. A first active element is mounted within the housing adjacent the first end, and a second active element mounted within the housing adjacent the second end. A fan assembly is mounted within the housing adjacent the second end to establish an airflow through the housing adjacent the first and second active elements for cooling thereof. An airfoil is mounted within the housing between the first and second active elements to accelerate and direct the airflow proximate the second active element.

Airfoil to provide directed cooling

Apparatus and method for maintaining processing devices at a nominally common temperature, such as but not limited to storage devices in a multi-device networked storage enclosure. In accordance with some embodiments, an enclosed housing has a first side adjacent a cold zone with a lower ambient temperature and an opposing second side adjacent a warm zone with a higher ambient temperature. First and second processing devices are arranged within the enclosed housing so that the first processing device is adjacent the cold zone and the second processing device is adjacent the warm zone. First and second thermal interface material (TIM) modules are contactingly affixed to the first and second devices and are provided with different heat conductivities so that the first and second devices are maintained at a nominally common operational temperature.

Growing community of inventors

Longmont, CO, United States of America

Shawn Jacob Noland