Gelcore, LLC

Lumination LLC

Shawn Du

Tomislav Josip Stimac

Thomas Frederick Soules

Matthew S Mrakovich

Mark J Mayer

Frank P Dornauer

Robert Schindler

Michael C Hsing Chen

A linear LED light module and system includes a heat sink, a printed circuit board, a plurality of LEDs, a power supply housing, a flexible electrical conductor, a first electrical connector, a second electrical connector, and a power supply. The heat sink is elongated in an axial direction along a longitudinal axis that is parallel with a greatest dimension of the heat sink. The PCB is in thermal communication with the heat sink and includes circuitry. The plurality of LEDs mount to the PCB and are in electrical communication with the circuitry of the PCB. The power supply housing connects to the heat sink. The flexible electrical conductor includes at least two wires that are configured to accommodate an AC line voltage of at least 120 VAC. The first electrical connector is at a first end of the electrical conductor. The second electrical connector is at a second end of the electrical conductor. The second connector has a configuration that complements the first connector so that the second connector can connect to an associated adjacent first connector of an associated adjacent LED module to allow a plurality of similar LED modules to be mechanically and electrically connected to one another. The power supply is disposed in the power supply housing and in electrical communication with the circuitry of the PCB and the electrical conductor. The power supply is configured to receive the AC line voltage from the electrical conductor and to convert the received AC line voltage to a lower DC voltage for delivery to the circuitry of the PCB to drive the LEDs mounted on the PCB.

Linear LED illumination system

In a chip package (), first and second electrical power buses () are each formed of an electrical conductor having a chip bonding portion () and a lead portion () extending away from the chip bonding portion. The chip bonding portions of the first and second electrical power buses have edges () spaced apart from one another to define an extended electrical isolation gap (). A plurality of chips () straddle the extended electrical isolation gap and are electrically connected with the first and second electrical power buses to receive electrical power from the first and second electrical power buses.

Power LED package

A light source () includes a light emitting semiconductor device (). A support substrate () has a generally planar reflective surface () that supports the semiconductor device (). The light emitting semiconductor device heat sinks via the support substrate. A curved reflector () has a concave parabolic reflective surface. The light emitting semiconductor device () is arranged between the support substrate () and the curved reflector (). The support substrate () and the curved reflector () together define a light aperture () through which light produced by the light emitting semiconductor device () passes.

LED planar light source and low-profile headlight constructed therewith

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Macedonia, OH, United States of America

Shawn Du