Medtronic, Inc.

Battelle Memorial Institute

Shawn D Knowles

Rajesh V Iyer

Simon E Goldman

Jennifer J Zhao

Micah A Litow

Dawit Y Belete

Jonathan L Kuhn

William John Taylor

Timothy J Davis

Joyce Yamamoto

Daniel J Koch

Susan A Tettemer

John P Tardiff

James D Reinke

Gregory John Haubrich

Can Cinbis

Thomas A Anderson

Jonathan P Roberts

Robert Michael Ecker

David Nghiem

Lea A Nygren

Len D Twetan

Jeffrey M Jelen

Glenn W Hollenberg

Roger N Johnson

John C Olson

Michael E Nowak

Jeremy W Burdon

David J Senor

Steven V Forbes

Roger L Hubing

An implantable medical device includes a hermetically sealed housing and a first light emitting diode (LED) enclosed within the housing configured to detect light corresponding to a selected light wavelength. A conductive element extends from the LED for carrying a current signal corresponding to the light detected by the LED, the intensity of the detected light being correlated to a change in a physiological condition in a body fluid volume or a tissue volume proximate the LED.

Implantable optical sensor and method for use

An implantable optical sensor and associated manufacturing method include a sensor housing having an inner surface and an outer surface and a window formed in the housing extending between the housing inner surface and the housing outer surface. An opto-electronic device enclosed within the housing and having a photonic surface is operatively positioned proximate the window for emitting light through the window or detecting light through the window. An optical coupling member is positioned between the opto-electronic device and the window for reducing light reflection at a surface within the implantable optical sensor.

Implantable optical sensor and method for manufacture

An implantable medical electrode comprising an electrode substrate having an exterior surface, and a zirconium nitride coating disposed over the exterior surface.

Implantable electrodes having zirconium nitride coatings

An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthrough, wherein the unfiltered feedthrough is adapted for connection to the outwardly extending circuit element; and including means for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough.

Method and apparatus for minimizing EMI coupling in a feedthrough array having at least one unfiltered feedthrough

A method of forming a filtering capacitor feedthrough assembly for an implantable active medical device includes inserting a terminal pin into an aperture of a capacitor, the capacitor configured to be electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device, then disposing an electrically conductive continuous coil within the aperture between the terminal pin and the capacitor and then fixing the continuous coil to the terminal pin or the capacitor. The continuous coil includes an inner diameter defined by a plurality of coils, the terminal pin extending through the inner diameter of the continuous coil so that the plurality of coils circumferentially surround the terminal pin. The electrically conductive continuous coil mechanically secures and electrically couples the terminal pin to the capacitor.

Methods of forming a filtering capacitor feedthrough assembly

A filtered feedthrough assembly having at least one terminal pin therethrough is provided. The feedthrough assembly comprises a ferrule having a cavity therethrough for receiving the terminal pin, and insulating structure having an upper surface. The insulating structure is disposed within the cavity and around the terminal pin for electrically isolating the pin from the ferrule. A capacitor is disposed around the pin and electrically coupled thereto. The capacitor has a lower surface that is disposed proximate the upper surface, and at least one washer is disposed between the upper surface and the lower surface. To attach the capacitor to the insulating structure, a body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the at least one washer.

Filtered feedthrough assembly and method of manufacture

A medical device feedthrough assembly includes a flange plate formed with a plurality of receptacles. A feedthrough subassembly is mounted within each of the receptacles, and a ferrule of each subassembly is coupled to the flange plate.

Implantable medical device feedthrough assembly including flange plate

A filtering capacitor feedthrough assembly for an implantable active medical device is disclosed. The filtering capacitor feedthrough assembly includes a capacitor having an aperture, the capacitor is electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device. A terminal pin extends into the aperture and an electrically conductive continuous coil is disposed within the aperture and between the terminal pin and the capacitor. The electrically conductive continuous coil mechanically secures and electrically couples the terminal pin to the capacitor.

Filtering capacitor feedthrough assembly

An electronic module assembly for an implantable medical device includes a non-conductive block having an opening for accepting a feedthrough conductor. The block has opposite first and second ends and opposite first and second sides. A bond pad is located on the first end of the block for electrical connection to a feedthrough conductor, and the bond pad extends to the first side of the block to provide an electrical connection region there.

Filtered electrical interconnect assembly

A method for attaching a capacitor to the feedthrough assembly of a medical device having a terminal pin comprises threading a first washer over the terminal pin, and placing a body of epoxy in contact with the first washer. The capacitor is positioned over the terminal pin such that the first washer and the body of epoxy are between the lower surface of the capacitor and a support surface. The body of epoxy is cured to couple the capacitor to the insulating structure. During curing, the body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the first washer.

Method of attaching a capacitor to a feedthrough assembly of a medical device

An improved multi-polar feedthrough assembly employs a particular metallic ferrule material for improved dimensional stability during initial fabrication and sustained hermetic operation. In one aspect, the disclosure relates to implantable medical devices (IMDs) including an IMD enclosure fabricated with grade 2 titanium and having a ferrule material fabricated with grade 4 titanium or grade 5 titanium. In one form, the multi-polar feedthrough assembly includes a filtered feedthrough array (e.g., employing capacitive filters coupled to the electrically conductive pins or serpentine conductors of the array). According to another aspect, the improved multi-polar feedthrough assembly incorporates additional pins, thus increasing the footprint of the assembly, and the additional pins provide analog electrical communication between operative circuitry inside an IMD and analog components external to the IMD.

Multi-polar feedthrough array for analog communication with implantable medical device circuitry

A feedthrough assembly for guiding a plurality of terminal pins through the housing of an implantable medical device. The feedthrough assembly comprises a ferrule fixedly coupled to the housing and having an aperture therethrough, and a non-conductive supporting structure fixedly coupled to the plurality of terminal pins and disposed within the aperture. The supporting structure is configured to guide the plurality of terminal pins through the ferrule. A plurality of capacitors, which is fewer in number than the plurality of terminal pins, is fixedly coupled to the supporting structure and electrically coupled between the ferrule and selected ones of the plurality of terminal pins.

Multipolar feedthrough assembly with customizable filter and method of manufacture

The invention includes a family of miniaturized, hermetic electrical feedthrough assemblies having at least one passive electrical component electrically coupled to a conductive pathway traversing each said assembly which are adapted for implantation within a biological system. The electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device (IMD) such as an implantable pulse generator, cardioverter-defibrillator, physiologic sensor, drug-delivery system and the like. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. Such an assembly is fabricated by interconnected electrical pathways, or vias, of a conductive metallic paste disposed between ceramic green-state material. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one embedded metallization pathway extending through the structure.

Implantable co-fired electrical interconnect systems and devices and methods of fabrication therefor

A method for forming a diffusion coating on the interior of surface of a hollow object wherein a filament, extending through a hollow object and adjacent to the interior surface of the object, is provided, with a coating material, in a vacuum. An electrical current is then applied to the filament to resistively heat the filament to a temperature sufficient to transfer the coating material from the filament to the interior surface of the object. The filament is electrically isolated from the object while the filament is being resistively heated. Preferably, the filament is provided as a tungsten filament or molybdenum filament. Preferably, the coating materials are selected from the group consisting of Ag, Al, As, Au, Ba, Be, Bi, Ca, Cd, Co, Cr, Cu, Dy, Er, Eu, Fe, Ga, Ge, Hg, In, K, Li, Mg, Mn, Na, Ni P, Pb, Pd, Pr, S, Sb, Sc, Se, Si, Sn, Sr, Te, Tl, Y, Yb, Zn, and combinations thereof. The invention additionally allows for the formation of nitrides, hydrides, or carbides of all the possible coating materials, where such compounds exist, by providing a partial pressure of nitrogen, hydrogen, hydrocarbons, or combination thereof, within the vacuum.

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St. Francis, MN, United States of America

Shawn D Knowles