Seagate Technology Incorporated

Shawn A Mawla

Connie C Liu

Linda Lijun Zhong

Jeff Duane St John

Jeff A Railton

Jeffrey Lee Petrehn

Roger Rostron Wills

Abnormal nodule formation during electroless plating, e.g., of amorphous NiP &ldquo;seed&rdquo; layers utilized in the manufacture of magnetic recording media, is eliminated or substantially reduced by performing the electroless plating process in an apparatus employing polymeric or polymer-based materials which are substantially resistant to degradation upon prolonged contact with the electroless plating bath at an elevated temperature, i.e., release of soluble, low molecular weight, carbon-containing species which are incorporated in the electroless plating deposit and act as nucleation centers for abnormal growth leading to nodule formation. Suitable degradation-resistant polymeric materials for use as fittings, piping, racks, tanks, etc. of the electroless plating apparatus include fluorine-containing hydrocarbons and fluorocarbons.

Nodule-free electroless nip plating

Surface processing of metal, such as CMP, is enhanced and defects reduced by pretreatment to remove a surface layer exhibiting properties different from the bulk metal, such as a baked on oxide layer. Embodiments of the present invention include acid soaking a non-magnetic substrate having an Al, Ni or Ni&mdash;P surface with a baked oxide film thereon, thereby removing the oxide film and rendering the reduced surface amenable to CMP with reduced defects, reduced surface roughness and increased production throughput.

Pretreatment for reducing surface treatments defects

Growing community of inventors

San Jose, CA, United States of America

Shawn A Mawla