Inventec Corp.

Shaw-Fuu Wang

Ting-Chiang Huang

Sheng-Jie Syu

Feng-Ku Wang

Shih-Chen Shen

Li-Ting Wang

Chiun-Peng Chen

Chih-Kuang Chung

A heat sink is used for dissipating thermal energy generated by an electronic component of an electronic device. The heat sink includes a contact base and a fin base. The contact base is attached on the electronic component to transfer thermal energy, and the fin base is pivotally connected to the contact base to transfer thermal energy with the contact base. The fin base has a plurality of fins, and rotates relative to the contact base. A center of gravity of the fin base deviates from a rotation axis. When the electronic device is moved, due to the deviated center of gravity, the fin base rotates to make the fins disturb the air inside the electronic device.

Heat sink structure

An electronic device includes a casing, a thermal generating element, and a heat sink. The thermal generating element is disposed within the casing and operates to produce thermal energy. The heat sink includes a thermal transfer plate and a plurality of movable thermal transfer members. The thermal transfer plate contacts the thermal generating element and includes a plurality of recesses. Each of the movable thermal transfer members has a weight end and a free end. The weight end is accommodated in the recess. The thermal energy produced by the thermal generating element is conducted to the movable thermal transfer members via the thermal transfer plate. When the casing is tilted by a certain angle, the movable thermal transfer member swings relative to the thermal transfer plate, such that the free end thereof points to a direction opposite to that of an acceleration of gravity under a normal state.

Electronic device and heat sink thereof

A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.

Heat dissipating module

A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance.

Heat dissipation device

A heat dissipation module including a supporting frame, a driver, a linkage, a first magnet and a plurality of magnetic blades is provided. The supporting frame has a chute. Moreover, one end of the linkage has a protrusion passing through the chute. The other end of the linkage is connected to the driver. The first magnet is disposed on the protrusion. In addition, the repelling magnetic blades are pivoted on the supporting frame. The outermost magnetic blade faces the first magnet and they repel each other.

Heat dissipation module

A swing type fan including a frame, a motor, at least one blade, at least one first magnetic element and at least one second magnetic element is provided. The motor is fixed to the frame and has a shaft passing through the frame. The blade is disposed between the shaft and the frame and has a first side and a second side opposite to the first side. The first side of the blade is connected to the frame. The first magnetic element is disposed on the blade and is located between the first side and the second side of the blade. The second magnetic element is connected to the shaft and is corresponding to the first magnetic element. The second side of the blade swings via a magnetic force between the first magnetic element and the second magnetic element as the shaft drives the second magnetic element to rotate.

Swing type fan

A heat dissipation device, electrically connected to an intermittent power source, is used for dissipating heat generated by a heat-generating element on a circuit board. The heat dissipation device has at least one coil and at least one vibrating sheet. The coil is used to receive the intermittent power source to produce a magnetic field. One end of the vibrating sheet is fixed, and the other end is suspended over the coil. The suspended end flutters periodically under the magnetic force of the intermittent magnetic field, so as to produce an airflow.

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Taipei, Taiwan

Shaw-Fuu Wang