Applied Materials, Inc.

Shaun Van Der Veen

Steven M Zuniga

Jagan Rangarajan

Edward Golubovsky

Justin Ho Kuen Wong

Hung Chih Chen

A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.

Wafer processing tools and methods thereof

A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.

Stepped retaining ring

A two part retaining ring is described. An rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.

The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput. Embodiments of the present invention eliminate load cups from a polishing system, hence improve throughput by reducing system footprint and substrate hand off. One embodiment provides an apparatus for polishing a substrate. The apparatus comprises a platen having a polishing pad supported thereon, a carrier head configured to hold the substrate and press the substrate against the polishing pad, and a retaining ring adapted to be attached to and detached from the carrier head, wherein the retaining ring is configured to receive the substrate while positioned on the polishing pad and detached from the carrier head.

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San Jose, CA, United States of America

Shaun Van Der Veen