Lucent Technologies Inc.

Triquint Technology Holding Co.

Shaun P Scrak

Timothy Butrie

Mindaugas Fernand Dautartas

Rao Yelamarty

Brian Dale Potteiger

Fridolin L Bosch

Frederick Arthur Yeagle

Stephen James Salko

Thomas James Miller, Jr

Lu Fang

George Edward Andrews

Leo Anthony Procida

Timothy P Bock

An uncooled, through-hole configured laser module adapted to receive and transmit RF signals to a laser at bandwidths from direct current (DC) to about ten gigahertz. The laser module incorporates an option for two pin-out configurations. One pin-out configuration has one ground pin and one signal pin for operation at about one gigabit/second or one gigahertz. The second high performance pin-out uses two ground pins and one signal pin for operation up to about ten gigabit/second or ten gigahertz.

Uncooled universal laser module

An apparatus for performing fluxless soldering includes an enclosure having a gas inlet through which an inert gas is introduced to create an inert gas-rich environment. Components are placed in the enclosure via an access port which also functions as a vent for allowing purge gases to vent from the enclosure. In one embodiment, a heating stage is provided in the enclosure which provides sufficient heat to reflow solder provided between two or more components. The inert gas is constantly flowing, or purging the enclosure in order to displace oxygen that would initially be present in the system. The presence of inert gas exclusive of other materials provides an oxygen-free environment, i.e., the inert gases provide a &ldquo;shield&rdquo; or environment around the parts to be soldered to inhibit the formation of additional oxides during soldering. The apparatus may also include an optics holder for transmitting light from an external light source into the enclosure, to permit visual alignment of component parts.

Automated fluxless soldering using inert gas

Disclosed is an optical package which is economical to manufacture. An optical component, such as a PIN photodiode, is bonded to a substrate such as silicon with no metallization on its side surfaces. The resulting assembly is solder bonded to the bottom surface of the package so that a side surface of the substrate is adjacent to the bottom surface with essentially no solder therebetween.

Optical component package

Growing community of inventors

Souderton, PA, United States of America

Shaun P Scrak