Hewlett-Packard Development Company, L.p.

Hewlett-Packard Company

Shaun Lee Harris

Gary Williams

Christian Laszlo Belady

Eric C Peterson

Brent A Boudreaux

Steven A Belson

Stuart C Haden

Paul Anthony Wirtzberger

Jeffrey Christenson

Bradley Dean Winick

Michael C Day

Ray G Sadler

Russ William Herrell

Roy M Zeighami

Steve Belson

Lisa Heid Pallotti

David Fisk

Stephan Karl Barsun

Robert B Curtis

Brandon Rubenstein

Jeffrey Allan Oberski

Jeffrey Todd Haselby

Randy K Rannow

Rico Brooks

Jeffrey N Metcalf

Michael McHugh

Paul T Artman

James Steven Wells

Stev Arthur Belson

David A Klein

Greg Huff

A power throttling method and system for a memory controller in a computer system comprising a power supply module including a plurality of bulk power supplies ('BPSs') are described. In one embodiment, each of the at BPSs provides to a power output monitor a status signal indicative of a status thereof. Responsive to receipt of the status signals, the power output monitor determines whether a bulk power supply capacity is below system power requirements. Responsive to a positive determination, the power output monitor drives a throttle control signal to the memory controller to a level indicative of an over-threshold state.

System and method for throttling memory power consumption

One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules are coupled to and disposed on a second side of the first PCB, the first and second power modules providing redundant power to the two processors on the second PCB.

Redundant power beneath circuit board

A subassembly of an apparatus, in one example, includes a first body member and a bias member. A fastener extending through the subassembly applies a compression force to the subassembly. A precompression member is engageable with the subassembly and the bias member so as to impart a precompression force to the bias member. In one example, the fastener is a screw engageable with a threaded plate and biased by a leaf spring which is precompressed to facilitate initial engagement of the screw and the threaded plate.

Heat sink with precompressed bias member

Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Multi-chip module with power system

An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Multi-processor module

A power throttling method and system for a memory controller in a computer system. One embodiment includes, responsive to a determination that a change in the state of a cover switch has occurred that will result in an increase in an operating temperature of at least one memory device during normal operation, driving a throttle control signal to the memory controller to a level indicative of an over-threshold state.

System and method for throttling memory power consumption based on status of cover switch of a computer system

A fused power cable assembly and method of integrating a protective device with a power source connector retaining bracket. A bracket assembly having a bulkhead retaining element, a protective device element, and a retaining element operable to couple the protective device to the bracket allows for mounting of protective device(s) to the bracket instead of the bulkhead, thereby saving space. A power cabling assembly having a bracket assembly, a power connector, and a fastening element operable to couple the power connector to the bulkhead and the bulkhead to the bracket assembly, allowing assembly of the power cabling assembly prior to installation into target equipment.

Power cabling assembly

A memory assembly module including an on-board voltage regulator for converting an externally supplied voltage into appropriate local voltage levels for powering memory devices of the memory assembly module.

Redundant voltage distribution system and method for a memory module having multiple external voltages

A system comprises a converter to produce an output voltage from at least a first input voltage and a second input voltage, and a selector to select a first circuit path in the converter to produce the output voltage from the first input voltage, and to select a second circuit path in the converter to produce the output voltage from the second input voltage.

Converter to provide an output voltage for plural input voltages

A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.

Heat spreader with multiple stacked printed circuit boards

Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

Processor module with thermal dissipation device

An electronic processing system contains a power supply subsystem and a multi-processor module. Programmable control circuitry manages power consumption in the electronic system by allocating priority among a plurality of competing demands, such as total power consumption, power consumption at any one of the processors, and thermal measurements. Analog sense measurements of incoming power are transmitted to the control circuits, which are protected from noise through use of an isolation barrier established by a linear isolation amplifier.

System and method for managing power consumption for a plurality of processors based on a supply voltage to each processor, temperature, total power consumption and individual processor power consumption

Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.

Multi-chip module with power system and pass-thru holes

One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.

Growing community of inventors

McKinney, TX, United States of America

Shaun Lee Harris