Raytheon Company

Shaun L Champion

Reza Tayrani

Richard D Young

Mark E Stading

Nick J Rosik

Philip H Ives

Norman C Lee

Harry A Andreas

Ives H Philip

Tho X Nguyen

Karrie D Dooley

Embodiments enable for the creation of microelectronic modules that may be configured in any order within a microelectronic assembly. The microelectronic modules provide for point-to-point interconnects between the modules using a standardized connector that is the same for each module. This, thereby, eliminates the need for a backplane. The modules may be configured in any order within a microelectronic assembly. No prior knowledge regarding the functions of an individual microelectronic module is required if the microelectronic modules conform to the standardized I/O of the standardized connector.

Microelectronic assemblies

A wireless temperature sensor network includes a base station unit which transmits query signals cyclically addressing a plurality of temperature sensor transponder units. The transponder units are passive and derive operating power from the query signal to encode measured temperature data into a reply signal which is received by the base station. In a dual carrier embodiment, the query signal and reply signals are transmitted on separate frequencies. In a backscattering embodiment, the antennas of the transponder units can be switched between an absorption mode in which the query signal is received and a reflection mode in which the query signal is reflected back to the base station. The transponder antennas are switched in such a manner as to encode temperature data in the reflected signal to form a reply signal. The network embodiments are particularly applicable to space based platforms.

Wireless temperature sensor network

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Redondo Beach, CA, United States of America

Shaun L Champion