Industrial Technology Research Institute

Shau-Yi Chen

Hsiu-Jen Lin

Yuh-Wen Lee

Ming-Sheng Leu

Chieh-Lung Lai

Jian-Shian Lin

Wei-Jieh Chang

Wei-Cheng Lih

Mau-Shen Liou

Shinn-Cherng Huang

A die-bonding method is suitable for die-bonding a LED chip having a first metal thin-film layer to a substrate. The method includes forming a second metal thin film layer on a surface of the substrate; forming a die-bonding material layer on the second metal thin film layer; placing the LED chip on the die-bonding material layer with the first metal thin film layer contacting the die-bonding material layer; heating the die-bonding material layer at a liquid -solid reaction temperature for a pre-curing time, so as to form a first intermetallic layer and a second intermetallic layer; and heating the die-bonding material layer at a solid-solid reaction temperature for a curing time for performing a solid-solid reaction. The liquid-solid reaction temperature and the solid-solid reaction temperature are both lower than 110&#xb0; C., and a melting point of the first and second intermetallic layers after the solid-solid reaction is higher than 200&#xb0; C.

Die-bonding method of LED chip and LED manufactured by the same

An electric arc ion plating apparatus to coat a metal material on an object includes: (a) an vacuum chamber; (b) an electric arc bombardment chamber in the vacuum chamber, comprising an anode, a cathode target, and an arc triggering electrode to generate metal particles when a voltage is applied on the anode and the cathode, and on the arc triggering electrode; and (c) a magnetic coil having a longitudinal axis. The magnetic coil emanates from the electric arc bombardment chamber and encloses at least a part of the electric bombardment chamber. The magnetic coil contains a constant-diameter section enclosing and immediately emanating from the electric arc bombardment chamber to guide the metal particles away from the cathode and toward the object, and a varying-diameter section away from the electric arc bombardment chamber to provide optimum distribution of the metal particles before they reach the object surface. The varying-diameter section can be a diverging section for effectively coating relatively large objects, or a converging section for efficiently coating a relatively small object.

Magnetic apparatus for arc ion plating

Growing community of inventors

Yunlin County, Taiwan

Shau-Yi Chen