Amazon Technologies, Inc.

Sharukh Shahajahan Shaikh

Kun Xu

Fnu Arun Kumar

An interconnect fabric in an integrated circuit (IC) device can be hierarchically partitioned into a set of peripheral sub-fabrics and a glue sub-fabric coupled to each of the peripheral sub-fabrics based on the physical design information associated with the IC device. Each of the peripheral sub-fabrics and the glue sub-fabric can be implemented using 2:1 hierarchical multiplexers based on an agglomerative clustering scheme. Physically aware design of the hierarchical multiplexer tree along with the optimal placement of the 2:1 multiplexers can provide smaller overall wire length and reduced routing congestion in the interconnect.

Growing community of inventors

San Jose, CA, United States of America

Sharukh Shahajahan Shaikh