Meta Platforms Technologies, LLC

Facebook Technologies, LLC

Sharon Nanette Farrens

Daniel Brodoceanu

Oscar Torrents Abad

Jeb Wu

Zheng Sung Chio

Tennyson Nguty

The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be &#x3bc;LEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.

Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers

Selectively bonding light-emitting devices via a pulsed laser

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

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Cork, Ireland

Sharon Nanette Farrens