Apple Inc.

Shaowei Qin

Victor H Yin

Daniel William Jarvis

Sawyer Isaac Cohen

Jean-Pierre Simon Guillou

Jason C Sauers

John J Baker

Zhen Zhang

Yi Tao

Douglas G Fournier

Yaocheng Zhang

Wenyong Zhu

Paul U Leutheuser

Izhar Zahoor Ahmed

Peter J Kardassakis

Ying-Chih Wang

Eric W Bates

Steven M Scardato

Hao Dong

Jingjing Xu

Adam Adjiwibawa

Shaorui Yang

Kikue S Burnham

Bulong Wu

Jason C Law

Isabel S Gueble

Siddharth Avachat

Sarah Trabia

Benjamin R Pope

An electronic device includes a housing that defines an aperture, and a display assembly positioned in the aperture. The display assembly can include a display layer having a first portion, and a second portion bending at least partially below the first portion. The first portion and the second portion can define a bend volume, and a potting material can be disposed in the bend volume, such that the potting material contacts the first portion and the second portion. An internal enclosure can be contoured to the display assembly.

Display panel bend reinforcement

A rigid flex printed circuit board (PCB), method of manufacture, and display system incorporating the same are described. In an embodiment, a rigid flex PCB includes a flexible area extending from an adjacent routing area that is thicker than the flexible area. A flexible inner core spans the flexible area and the adjacent routing area. Outer stack-up layers are on the flexible inner core in the adjacent routing area. A cavity is formed in the outer stack-up layers in the routing area and exposes the flexible inner core. In an embodiment, a display system including such a circuit board may include an electronic component mounted on the flexible inner core within the cavity, and a distal end of the flexible area is bonded to a display panel.

Display system and rigid flex PCB with flip chip bonded inside cavity

A thin-film transistor layer, an organic light-emitting diode layer, and other layers may be used in forming an array of pixels on a substrate in a display. Vias may be formed through one or more layers of the display such as the substrate layer to form vertical signal paths. The vertical signal paths may convey signals between display driver circuitry underneath the display and the pixels. The vias may pass through a polymer layer and may contact pads formed within openings in the substrate. Vias may pass through a glass support layer. Metal traces may be formed in the thin-film transistor layer to create signal paths such as data lines and gate lines. Portions of the metal traces may form vias through a polymer layer such as a substrate layer or a polymer layer that has been formed on top of the substrate layer.

Display with vias to access driver circuitry

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Milpitas, CA, United States of America

Shaowei Qin