Boe Technology Group Co., Ltd.

Boe Mled Technology Co., Ltd.

Beijing Jiaotong University

Shanwei Yang

Haiwei Sun

Junjie Ma

Yuanda Lu

Linxia Qi

Zhijun Xiong

Jiawei Zhao

Xu Wang

Zhan Gao

Qibo Feng

Jie Qin

Shengjia Wang

Chenjia Gao

Lingyun Shi

Jinpeng Li

A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Light-emitting diode chip, display substrate and manufacturing method thereof

A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Light-emitting chip and light-emitting substrate

A method for full-field measurement using Doppler imaging, comprising the following steps: turning on a laser and adjusting the laser; adjusting a spatial filter to obtain circular laser spots having uniform intensity distribution; adjusting a quarter-wave plate and a whole polarizer in a system, and requiring two beams in a reference object and a measured object having different frequencies and perpendicular polarization directions; applying slight pressure to the measured object, setting a charge coupled device (CCD) camera into a continuous acquisition mode, observing interference fringes, and adjusting a light path so that the fringes are clear and visible; setting the sampling frequency, sampling time, captured image format and resolution size of the CCD camera; turning on a lithium niobate crystal drive power switch to produce a heterodyne carrier frequency; applying continuous equal pushing force to the measured object by means of piezoelectric ceramics (PZT) so as to make the measured object produce continuous bending deformation; controlling the CCD camera to sample using a computer, and collecting a set of time series light interference images along with the continuous deformation of the measured object; and processing the time series light intensity interference image to obtain a three-dimensional data module comprising continuous deformation of the measured objects distributed in time and space.

Method for full-field measurement using dynamic laser doppler imaging

Growing community of inventors

Beijing, China

Shanwei Yang